Residue Collection Structure for Semiconductor Wafer Curing Chambers
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Solution Overview
Problem
During semiconductor processing, polymer-based materials like polybenzoxazole outgas during curing, leading to residues that condense and potentially contaminate wafers, causing defects due to improper collection in processing tools.
Innovation Solution
A semiconductor apparatus with a collecting module featuring a flow-directing structure and a tray configured to collect residues from the ceiling and a baffle structure to catch drips, preventing contamination of wafers by directing and collecting the outgassed materials effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If polymer-based materials are cured during semiconductor processing, then mechanical strength and hardness are improved, but outgassing occurs that leads to residue condensation and wafer defects
Solution Approach 1:
The patent converts the harmful outgassed residues into a beneficial collection process by designing a ceiling with condensation collection channels that direct the residues to collection trays, transforming the harmful condensation into a controlled collection system that prevents wafer contamination
Solution Approach 2:
The patent introduces an intermediary collection system consisting of the ceiling structure with integrated channels and collection trays that mediate between the outgassing source and the wafer, intercepting residues before they can contaminate the wafer surface
2Device complexity
If conventional processing tools are used without specialized residue collection structures, then device complexity is reduced, but wafer defects occur due to residue contamination
Solution Approach 1:
The ceiling structure serves multiple functions: it acts as the structural ceiling of the processing chamber, provides thermal insulation, and integrates condensation collection channels that direct residues to collection trays, eliminating the need for separate collection devices
Solution Approach 2:
The patent merges the ceiling structure with the residue collection system by integrating collection channels directly into the ceiling, combining two previously separate functions (ceiling support and residue collection) into a unified structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces wafer defects by thoroughly collecting residues of curable dielectric materials, ensuring a cleaner processing environment and improved yield in semiconductor manufacturing.
Implementation Method 1
A first portion of the residues of curable dielectric material dripping from a ceiling of the chamber is directed toward a tray using a flow-directing structure
Implementation Method 2
Another second portion of the residues of curable dielectric material flowing along an outer sidewall of the flow-directing structure is collected on a collecting surface of a baffle ring
Data Source
AI summary
A method for collecting residues of curable material includes: performing a curing process on a semiconductor wafer in a chamber, where the semiconductor wafer is held by a wafer cassette, and residues of curable material is formed in the chamber; and collecting the residues of curable material. A first portion of the residues dripping from a ceiling of the chamber is directed toward a tray using a flow-directing structure, where the flow-directing structure is below the ceiling of the chamber, the flow-directing structure includes a central opening and a slanted surface sloped to direct the first portion of the residues toward the central opening. The first portion of the residues is collected on a collecting surface of the tray which covers the central opening of the flow-directing structure.