Real-Time Semiconductor Residue Detection via In-Process Imaging
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Solution Overview
Problem
The miniaturization of semiconductor devices leads to increased complexity in manufacturing, with challenges in identifying defects and residues during fabrication, resulting in delayed production cycles due to the need for temporary suspension and adjustments.
Innovation Solution
A method involving a camera system to monitor and analyze semiconductor structures by capturing images, identifying residues and abnormalities, and performing real-time responses such as residue removal or nozzle adjustments based on image analysis, allowing for continuous manufacturing without interruptions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical inspection and failure analysis are performed to identify defects, then manufacturing reliability is improved, but production cycle time is increased due to temporary suspension
Solution Approach 1:
The patent applies preliminary action by implementing real-time monitoring during the manufacturing process to identify defects as they occur, rather than performing inspection after completion. The system continuously captures images and analyzes manufacturing parameters during fabrication, allowing defects to be detected before the process completes, thus avoiding production suspension while maintaining reliability
Solution Approach 2:
The patent implements feedback by creating a closed-loop system where real-time data from sensors and cameras is continuously analyzed, and corrective actions are automatically triggered based on detected anomalies. The system provides immediate feedback to the manufacturing process, enabling dynamic adjustments that maintain product quality without interrupting production flow
2Productivity
If real-time monitoring and analysis are implemented, then manufacturing efficiency is improved, but system complexity is increased
Solution Approach 1:
The patent applies universality by designing a monitoring system that performs multiple functions through integrated components. The same camera system and data processing platform handle various inspection tasks, parameter monitoring, and defect identification across different manufacturing stages, reducing the need for separate specialized systems and thereby limiting complexity increase
Solution Approach 2:
The patent replaces complex mechanical inspection systems with optical-based imaging and automated image analysis. Instead of physical contact measurement and manual inspection, the system uses cameras and computer vision algorithms to detect defects, simplifying the mechanical complexity while enhancing monitoring capabilities and productivity
Data Source
AI summary
A method of monitoring or analyzing a manufacturing of a semiconductor structure includes providing a semiconductor structure; providing a camera disposed around the semiconductor structure; disposing a liquid substance over the semiconductor structure; removing a portion of the semiconductor structure; removing the liquid substance from the semiconductor structure; capturing a plurality of first images of the semiconductor structure by the camera; analyzing the plurality of first images; identifying a region of the semiconductor structure where a residue of the liquid substance is disposed based on the analysis of the plurality of first images; and performing a response based on the identification of the region of the semiconductor structure.