Semiconductor Resin Test Piece Formation for Real Mold Adhesion Evaluation
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Solution Overview
Problem
Existing methods for manufacturing test pieces for adhesion evaluation tests, such as the pudding cup test, fail to accurately reproduce the conditions of actual mass production molds, making it difficult to evaluate the adhesion of sealing resins in semiconductor devices.
Innovation Solution
A method for manufacturing a test piece for adhesion evaluation that involves forming a test piece on the base member or insulating member from the sealing resin of a semiconductor device, using laser processing or etching to replicate the conditions of the actual mass production mold.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dedicated mold is used to prepare the test piece for the pudding cup test, then the test piece can be formed with specific shape and size, but the process conditions cannot be reproduced as in actual mass production mold
Solution Approach 1:
The injection mold is designed to serve dual purposes: producing actual semiconductor device components and forming test pieces for adhesion evaluation. The mold includes a cavity that forms both the semiconductor device housing and a pudding cup-shaped test piece, allowing the same mass production process conditions to be applied to both products.
Solution Approach 2:
The formation of the test piece and the semiconductor device components is merged into a single injection molding process. The mold cavity is configured to simultaneously form both the device housing and the test piece from the sealing resin, eliminating the need for separate dedicated molds and ensuring identical process conditions.
2Reliability
If the test piece is formed from sealing resin in actual mass production mold, then the phenomenon generated in actual mass production mold is directly reflected, but the test piece formation process becomes more complex
Solution Approach 1:
The mold cavity is segmented into distinct regions: one region forms the semiconductor device housing while another region forms the pudding cup-shaped test piece. This segmentation allows both components to be formed in the same mold under identical process conditions without interfering with each other.
Solution Approach 2:
The mold cavity has different local geometries optimized for different purposes: the main cavity forms the semiconductor device housing with its specific shape and features, while a separate localized cavity forms the pudding cup-shaped test piece. Each region is designed with the specific quality needed for its intended function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of test pieces that accurately reflect the phenomena in actual mass production molds, allowing for precise adhesion evaluation and improved dimensional accuracy, with the ability to evaluate adhesion at specific points prone to peeling, and identify process conditions affecting adhesion.
Implementation Method 1
forming a test piece for the adhesion evaluation test on the base member or on an insulating member under the base member from the sealing resin of the semiconductor device
Data Source
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AI summary
A method for manufacturing a test piece for an adhesion evaluation test includes a process S 100 of preparing a semiconductor device and a process S200 of forming a test piece for an adhesion evaluation test. In the process S100 of preparing the semiconductor device, the semiconductor device includes a base member, a semiconductor element mounted on the base member, and a sealing resin to seal the base member and the semiconductor element. In the process S200 of forming the test piece for the adhesion evaluation test, the test piece for the adhesion evaluation test is formed on the base member from the sealing resin of the semiconductor device.