Semiconductor Resin Alignment via Substrate Marks
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Solution Overview
Problem
The challenge in semiconductor device manufacturing is to ensure precise alignment and increased adhesion between the sealing resin and substrate, particularly as device sizes decrease, to prevent issues like wire short-circuiting and separation, while achieving higher output and reliability.
Innovation Solution
A method involving the use of marks in the X-axial direction on a substrate for precise placement of semiconductor elements, continuous application of sealing material along these marks, and dicing the substrate and sealing member in the Y-axial direction to form cut planes, ensuring accurate positioning and enhanced adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the size of semiconductor device is reduced, then higher output and brightness are achieved, but resin misalignment and adhesion problems occur
Solution Approach 1:
The patent applies preliminary action by forming marks on the substrate before mounting semiconductor elements and before applying sealing resin. These marks serve as pre-established alignment references that guide the subsequent positioning of sealing resin, ensuring precise placement even as device sizes are reduced. The marks are formed in advance to prevent misalignment issues that arise in miniaturized devices.
2Volume of moving object
If the contact surface area between sealing resin and substrate decreases, then smaller device size is achieved, but adhesion between sealing resin and substrate deteriorates
Solution Approach 1:
The patent applies local quality by creating a roughened surface layer on the substrate within the sealing resin contact region. This local surface modification increases the contact area and adhesion strength between the sealing resin and substrate specifically where needed, without affecting the overall device size. The roughened surface provides enhanced mechanical interlocking and chemical bonding areas, solving the adhesion problem in miniaturized devices.
3Manufacturing precision
If marks are used for resin alignment, then precise resin placement is achieved, but additional manufacturing steps are required
Solution Approach 1:
The patent merges the mark formation process with the existing semiconductor manufacturing process flow. The marks are formed using standard photolithography and etching techniques that are already part of the fabrication process, integrating the alignment reference creation into existing manufacturing steps rather than adding completely separate processes. This reduces the impact on manufacturing complexity while achieving precise resin placement.
Data Source
AI summary
A method for manufacturing a semiconductor device having a substrate on which conductor wiring is disposed, electrodes provided to the conductor wiring, a semiconductor element connected to the electrodes, and a sealing member that covers the semiconductor element, comprises; mounting a plurality of semiconductor elements on the substrate in the X-axial direction and the Y-axial direction, forming marks in the X-axial direction, supplying the sealing material onto the substrate to continuously-covering the plurality of semiconductor elements arranged in the X-axial direction along the marks, dicing the sealing member and the substrate in the Y-axial direction to form cut planes of the sealing member and the substrate in substantially one plane and being a pair of cut planes opposite one another.