Semiconductor Device Resin Case Injection Path Sealing
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Solution Overview
Problem
The high manufacturing costs and short lifespan of large-scale, precise molds used in transfer molding for semiconductor devices, particularly due to the deterioration of gate portions, lead to increased maintenance and management expenses.
Innovation Solution
A semiconductor device manufacturing method involving a resin case with an injection path extending from a storage space to the exterior, allowing for the injection of sealing material without the need for a large-scale and precise mold, using a substrate to store a semiconductor chip and seal the storage space with a sealing material like epoxy resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transfer molding is used to seal the circuit substrate, then sealing is achieved, but large-scale and precise molds are required resulting in increased manufacturing costs
Solution Approach 1:
The invention extracts the gate portion from the mold structure, transferring it to a separate resin case. This eliminates the need for precise, large-scale molds while maintaining sealing quality, as the gate is now part of the resin case rather than the mold itself.
Solution Approach 2:
The resin case with its integrated gate structure serves as a disposable or replaceable component. Instead of maintaining expensive, precision molds, the system uses simpler, cheaper resin cases that can be manufactured more economically and replaced if needed.
2Manufacturing precision
If precise gate portions are used in the mold, then sealing precision is improved, but the gate portions are easy to deteriorate resulting in short mold life-span
Solution Approach 1:
The gate portion is extracted from the mold and integrated into the resin case. This separation means the mold no longer contains vulnerable gate structures that deteriorate, extending mold life while maintaining precision through the resin case's integrated gate design.
Solution Approach 2:
The resin case is designed with the gate structure beforehand, protecting it from the harsh conditions of mold operation. This pre-integration shields the precise gate portion from deterioration during the sealing process, extending the overall system's operational life.
3Reliability
If frequent maintenance is performed on the mold, then reliability is maintained, but maintenance and management costs are increased
Solution Approach 1:
By extracting the gate portion from the mold and integrating it into the resin case, the invention eliminates the need for frequent mold maintenance. The resin case can be replaced or maintained separately, reducing the maintenance burden and costs on the main apparatus.
Solution Approach 2:
The resin case with its integrated gate serves as a consumable component that can be replaced rather than maintained. This approach is more cost-effective than frequently maintaining expensive molds, as replacement is simpler and cheaper than repair and calibration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs and improves moisture resistance of semiconductor devices by eliminating the requirement for a large-scale mold, enabling efficient sealing of both the storage space and injection paths with a variety of sealing materials.
Implementation Method 1
injecting a sealing material into the storage space via the injection path to seal the storage space
Data Source
AI summary
A semiconductor device includes a semiconductor chip, a substrate having a main surface on which the semiconductor chip is arranged, a resin case which has a storage space therein and a side wall, the side wall having an injection path extending from the storage space to a device exterior, the resin case having a first opening at a bottom side thereof, connecting the storage space to the device exterior, the substrate being disposed on the resin case, at a main surface side of the substrate facing at the bottom side of the resin case, and a sealing material filling the storage space and the injection path.