Semiconductor Resin Case Segmentation for Tracking and Heat Resistance
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Solution Overview
Problem
There is a technical challenge in developing a resin material for semiconductor devices that balances high heat resistance and comparative tracking index without compromising mechanical properties, leading to increased costs due to limited options and trade-offs between glass transition temperature and tracking resistance.
Innovation Solution
A semiconductor device design that employs two resin cases with different comparative tracking indices, where the first resin case with a higher index is used for critical areas to ensure safety and the second resin case with a lower index is used for non-critical areas, allowing for cost reduction by selecting materials based on functional requirements rather than high tracking index specifications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the glass transition temperature is increased to improve heat resistance, then heat resistance is improved, but tracking resistance decreases
Solution Approach 1:
The housing case is divided into multiple resin materials with different glass transition temperatures and tracking resistance characteristics. Each resin material is assigned to specific regions based on functional requirements, allowing simultaneous optimization of heat resistance and tracking resistance in different areas of the housing case.
Solution Approach 2:
Different regions of the housing case are assigned different resin materials with locally optimized properties. Areas requiring high heat resistance use resins with higher glass transition temperatures, while areas requiring high tracking resistance use resins with lower glass transition temperatures but better tracking properties.
2Temperature
If crosslinking units of aromatic system are increased to increase glass transition temperature, then heat resistance is improved, but aromatic rings increase to facilitate carbonization and reduce tracking resistance
Solution Approach 1:
The housing case uses multiple resin materials instead of a single resin type. Resins with different chemical compositions (different aromatic ring contents and crosslinking densities) are combined, allowing each resin to contribute its strengths without suffering from the weaknesses of the others.
Solution Approach 2:
The housing case is constructed as a composite structure using multiple resin materials with different chemical compositions. This composite approach allows the system to achieve both high heat resistance and high tracking resistance by combining materials that excel in different properties.
3Reliability
If resin material with high heat resistance and high comparative tracking index is selected, then both heat resistance and tracking resistance are improved, but cost increases and material options are extremely limited
Solution Approach 1:
The housing case uses multiple resin materials with different performance levels and cost structures. High-performance, high-cost resins are used only where absolutely necessary, while lower-cost resins are used in less critical areas, thereby reducing overall material cost while maintaining required performance.
Solution Approach 2:
The invention changes the material selection strategy from using a single high-performance resin to using multiple resins with different parameter combinations. This allows optimization of the cost-performance ratio by matching material parameters to actual functional requirements in different housing case regions.
Data Source
AI summary
The present disclosure has been conceived to solve such a problem, and it is an object of the present disclosure to provide a semiconductor device enabling reduction in cost. A semiconductor device according to the present disclosure includes: a base plate; an insulating substrate disposed over the base plate; a semiconductor chip disposed over the insulating substrate; a first resin case and a second resin case attached to the base plate to enclose the insulating substrate and the semiconductor chip, and fitted together; and a sealing material to seal the insulating substrate and the semiconductor chip, wherein the first resin case and the second resin case are formed of resin materials having different comparative tracking indices.