Semiconductor Device Resin Layer Feedthrough Electrode Breakage
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Solution Overview
Problem
Existing semiconductor devices packaged using three-dimensional technology face challenges in achieving smaller and thinner form factors due to breakage issues in the wiring layer caused by stepped portions between feedthrough electrodes and the semiconductor substrate, and the need for further miniaturization and weight reduction in electronic devices.
Innovation Solution
A semiconductor device design that eliminates the interposer substrate by forming a resin layer on the semiconductor substrate to prevent breakage, with a wiring layer connected to feedthrough electrodes through an opening in the resin layer, and additional resin layers to reduce stress and warp, allowing for rerouting and stacking without an interposer substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an interposer substrate is used for packaging semiconductor devices, then connection reliability is improved, but device size and thickness increase
Solution Approach 1:
The patent removes the interposer substrate from the packaging structure, extracting the problematic component that caused increased thickness. The feedthrough electrodes are directly connected to wiring layers on the semiconductor substrate without requiring an intermediate substrate, thereby reducing device thickness while maintaining connection reliability through direct bonding.
Solution Approach 2:
The patent merges the functions of the interposer substrate into the semiconductor substrate itself by forming wiring layers and connection structures directly on the substrate. This integration eliminates the need for a separate interposer layer, combining multiple functions into a single substrate structure and reducing overall device thickness.
2Ease of manufacture
If feedthrough electrodes are made to project from the semiconductor substrate surface, then wiring connection is simplified, but wiring layer breakage occurs due to stepped portions
Solution Approach 1:
The patent applies a resin layer over the stepped portions formed by projecting feedthrough electrodes before forming the wiring layers. This resin layer acts as a cushioning material that fills the steps and provides a flat surface, preventing wiring layer breakage during subsequent processing and ensuring wiring integrity while maintaining ease of connection.
Solution Approach 2:
The resin layer serves as an intermediary material between the stepped feedthrough electrodes and the wiring layers. It mediates the mechanical stress and topography differences, providing a smooth transition surface that allows wiring layers to be formed without breakage while still enabling electrical connection to the feedthrough electrodes.
3Weight of moving object
If the semiconductor device is miniaturized for electronic instruments, then weight and size are reduced, but packaging density and connection reliability become more difficult to maintain
Solution Approach 1:
The patent utilizes three-dimensional packaging by stacking multiple semiconductor devices vertically on the substrate, transitioning from two-dimensional lateral arrangement to three-dimensional vertical arrangement. This dimensional change allows high packaging density and weight reduction by efficiently utilizing the vertical space, maintaining connection reliability through the feedthrough electrode structure that enables inter-layer connections.
Data Source
AI summary
A semiconductor device includes: a semiconductor substrate having an active surface and a back surface; an integrated circuit formed on the active surface; a feedthrough electrode penetrating the semiconductor substrate, and projecting from the active surface and the back surface; a first resin layer formed on the active surface, having a thickness greater than a height of a portion of the feedthrough electrode that projects from the active surface, and having an opening portion for exposing at least a portion of the feedthrough electrode; a wiring layer which is formed on the first resin layer, and which is connected to the feedthrough electrode through the opening portion; and an external connecting terminal connected to the wiring layer.