Semiconductor Resin Composition for Uniform Inorganic Particle Distribution
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Solution Overview
Problem
The existing semiconductor resin compositions face challenges in achieving uniform distribution of inorganic particles, leading to non-uniform thermal stress and reduced connection reliability between chips, especially when subjected to temperature changes, due to high amounts of fine inorganic particles and insufficient dispersion of polyimide or rubber particles.
Innovation Solution
A semiconductor resin composition comprising an epoxy compound, inorganic particles, polyimide, and rubber particles, with a specific weight ratio of inorganic particles between 60 wt% and 92 wt%, which ensures uniform distribution and adequate thermal stability, reducing thermal stress and maintaining connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If fine inorganic particles are mixed in large amounts in the underfill material to reduce the difference in coefficient of linear expansion with the chip, then the coefficient of linear expansion matches the chip better, but the distribution of inorganic particles becomes nonuniform in the film thickness direction
Solution Approach 1:
The patent changes the particle size parameter of inorganic particles from fine (causing nonuniform distribution) to coarse (achieving uniform distribution). This parameter change resolves the contradiction by maintaining the coefficient of linear expansion match while eliminating the distribution nonuniformity problem in the film thickness direction
Solution Approach 2:
The patent applies local quality by using coarse inorganic particles that naturally distribute uniformly throughout the film thickness, creating consistent local properties throughout the material. This ensures uniform thermal stress distribution while maintaining overall compositional stability
2Stability of the object's composition
If fine inorganic particles are mixed in large amounts in the underfill material, then the coefficient of linear expansion difference with the chip is reduced, but thermal stress difference in the film thickness direction increases
Solution Approach 1:
The patent changes the particle size parameter from fine to coarse, which fundamentally alters the stress distribution characteristics. Coarse particles create uniform thermal stress distribution throughout the film thickness, resolving the contradiction by maintaining compositional stability while eliminating thermal stress differences
3Temperature
If polyimide is mixed to impart heat resistance to the underfill material, then heat resistance is improved, but dispersion of inorganic particles becomes insufficient
Solution Approach 1:
The patent changes the particle size parameter of inorganic particles to coarse, which improves dispersion characteristics in the polyimide matrix. This parameter change resolves the contradiction by maintaining heat resistance while achieving sufficient and uniform dispersion of inorganic particles
4Stress or pressure
If rubber particles are mixed to relax stress exerted on the cured underfill material, then stress relaxation is improved, but the coefficient of linear expansion increases
Solution Approach 1:
The patent changes the particle size parameter of inorganic particles to coarse, which compensates for the coefficient of linear expansion increase caused by rubber particles. This parameter change resolves the contradiction by maintaining stress relaxation capabilities while preserving compositional stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a uniform distribution of inorganic particles, providing enhanced heat resistance and reduced thermal stress, thereby improving the connection reliability between semiconductor chips, especially under conditions of temperature changes.
Implementation Method 1
When the distribution of the inorganic particles is nonuniform, this causes a thermal stress difference in the film thickness direction
Implementation Method 2
Although an epoxy resin is commonly used for the underfill material for providing adhesiveness
Data Source
AI summary
The objective of the present invention is to obtain a semiconductor resin composition having a sufficiently low coefficient of linear expansion of the cured product thereof and a uniform distribution of inorganic particles in the direction of film thickness of a produced semi-cured film thereof. The semiconductor resin composition, which contains (a) an epoxy compound, (b) inorganic particles, (c) a polyimide, and (d) a solvent, is characterized by further containing (e) rubber particles and by the fraction of the (b) inorganic particles in the weight of the total solid fraction resulting from subtracting the weight of the (d) solvent from the total weight of the semiconductor resin composition being 60-92 wt % inclusive.