Semiconductor Passivation Film Resin Layer Surface Smoothing
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Solution Overview
Problem
The uneven surface of passivation films in semiconductor devices leads to nonuniform deposition of conductive films during sputtering, increasing resistance values and line breakage in wirings.
Innovation Solution
A semiconductor device design featuring a first resin layer on the passivation film, followed by a second resin layer with higher thermal resistance that covers the first layer, creating a smoother surface for wiring formation, which improves wiring reliability and reduces thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conductive film is formed on the passivation film by sputtering, then the wiring is formed, but the deposition becomes nonuniform due to the uneven surface, leading to increased resistance and line breakage
Solution Approach 1:
A resin layer is introduced as an intermediary between the uneven passivation film surface and the conductive film deposition process. This resin layer provides a flat upper surface that enables uniform sputtering deposition of the conductive film, while being formed through a process that accommodates the underlying uneven topology.
Solution Approach 2:
The resin layer is formed in advance before the conductive film deposition. This preliminary action creates a flat forming surface that will serve as the substrate for subsequent uniform sputtering, preventing the uneven passivation film from directly affecting the conductive film quality.
2Shape
If the passivation film has an uneven surface, then it reflects the structure below, but this unevenness causes nonuniform film deposition and wiring defects
Solution Approach 1:
The resin layer acts as a mediator that decouples the surface topology requirements. It allows the passivation film to maintain its structural reflection of underlying features while providing a flat upper surface for precise film deposition.
Solution Approach 2:
The resin layer provides different surface characteristics at different levels: it conforms to the uneven passivation film surface at the bottom while providing a flat upper surface for deposition, creating local quality variations that satisfy different functional requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The smoother surface formed by the second resin layer enhances the reliability of the wirings by preventing nonuniform film deposition and reducing the risk of line breakage, while also providing improved thermal resistance.
Implementation Method 1
when a conductive film is formed on the passivation film by sputtering, deposition of the film may become nonuniform if the surface is uneven
Implementation Method 2
forming of the first resin layer may include forming a thermosetting first resin precursor layer and heating the first resin precursor layer
Data Source
AI summary
A semiconductor device includes: a semiconductor substrate that has an integrated circuit, a passivation film formed above the integrated circuit, and an electrode electrically connected to the integrated circuit, the passivation film having an uneven surface, the electrode having at least a portion exposed through the passivation film; a first resin layer that is disposed on the passivation film; a second resin layer that covers the passivation film and the first resin layer; and a wiring that extends from the electrode to a first part of the second resin layer above the first resin layer, the electrode passing on a second part of the second resin layer above the passivation film.