Semiconductor Resin Sealing Structure for Stable Lead Connection
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving a robust and efficient sealing mechanism for semiconductor elements, particularly in ensuring a stable and reliable electrical connection between the elements and the leads, while maintaining a compact and durable package structure.
Innovation Solution
A semiconductor device design that incorporates a sealing resin with specific surface configurations and lead structures, including inclined and convex surfaces, along with a stepped profile for the leads, to enhance the electrical connection and durability, while using a mold-shaped resin surface for finer roughness and minimizing exposure of filler particles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional sealing resin structure is used, then the manufacturing process is simple, but the electrical connection stability and durability are insufficient
Solution Approach 1:
The sealing resin is designed with different surface roughness characteristics in different regions: a first surface with finer roughness for stable electrical connection, and a second surface with larger roughness for enhanced mechanical interlocking. This local differentiation of surface properties improves both electrical connection stability and overall durability without requiring complex additional structures.
Solution Approach 2:
The sealing resin employs an asymmetric dual-surface configuration where the first surface and second surface have deliberately different roughness characteristics. This asymmetric design allows each surface to optimize its function - one for electrical connection stability and the other for mechanical bonding - thereby improving reliability while maintaining manufacturing simplicity.
2Reliability
If the sealing resin surface is made smooth, then the electrical connection is improved, but the mechanical interlocking and durability are reduced
Solution Approach 1:
Different regions of the sealing resin are assigned different surface roughness qualities: the first surface has finer roughness to enhance electrical connection stability, while the second surface has larger roughness to provide strong mechanical interlocking. This local quality differentiation resolves the contradiction between smooth surfaces for electrical contact and rough surfaces for mechanical strength.
3Strength
If filler particles are exposed on the sealing resin surface, then the material properties are enhanced, but the surface quality and device durability are reduced
Solution Approach 1:
The sealing resin contains filler particles within its matrix, and the first surface is specifically designed with finer roughness that minimizes filler particle exposure. This local control of surface quality ensures that the filler particles remain embedded, maintaining both the material strength and the surface quality needed for reliable electrical connections and device durability.
Data Source
AI summary
A method for manufacturing a semiconductor device, the method includes mounting a semiconductor element on a lead frame, placing a mold to position the semiconductor element within a cavity of the mold, forming a resin intermediate by introducing a resin material into the cavity and hardening the resin material, and cutting the lead frame and the resin intermediate. The mold includes: a mold first surface and a mold second surface, a mold third surface, a mold fourth surface, and a mold fifth surface. The mold fifth surface includes a mold first section, a mold second section, and a mold third section. At least a portion of the mold third section is inclined relative to the second direction and the third direction as viewed in the first direction.