Semiconductor Chip Mounting Resin Leakage Control
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Solution Overview
Problem
The manufacturing process of tab exposure type semiconductor devices faces challenges in suppressing resin leakage onto the lower surface of the chip mounting portion, which reduces heat radiation efficiency and connection reliability due to the inability to effectively remove resin from the ditch without affecting the Ni/Pd/Au plating film.
Innovation Solution
A cleaning process is implemented to remove resin from the ditch on the lower surface of the chip mounting portion after sealing, followed by forming a plating film on the inner wall of the ditch, ensuring efficient resin removal and improved heat radiation and connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the sealing body is formed while exposing the lower surface of the chip mounting portion, then heat radiation efficiency is improved, but resin leakage onto the lower surface increases
Solution Approach 1:
A ditch is formed on the lower surface of the chip mounting portion before the sealing body is formed. This preliminary structure prevents resin from spreading onto the exposed lower surface during the sealing process, thereby maintaining both heat radiation efficiency and preventing resin leakage contamination.
Solution Approach 2:
The resin leakage problem is isolated to the ditch region, which acts as a separate containment area. The ditch extracts the harmful resin accumulation away from the critical heat radiation surface, allowing the exposed lower surface to maintain its thermal performance while the ditch safely holds the leaked resin.
2Reliability
If resin leakage is suppressed to maintain heat radiation efficiency, then connection reliability improves, but manufacturing complexity increases
Solution Approach 1:
The ditch structure is created in advance before sealing, establishing a passive barrier against resin leakage. This preliminary action ensures connection reliability by preventing resin contamination of the chip mounting surface without requiring complex active control systems or multiple processing steps during sealing.
Solution Approach 2:
The ditch introduces a localized structural feature only where needed at the periphery of the chip mounting portion. This local modification maintains the overall simplicity of the manufacturing process while providing targeted resin containment exactly where resin leakage would affect connection reliability.
3Manufacturing precision
If a cleaning process is added to remove resin from the ditch, then resin removal effectiveness improves, but manufacturing time increases
Solution Approach 1:
The mechanical cleaning process is replaced with an electrochemical etching process that uses electrical current to selectively remove resin from the ditch. This substitution achieves effective resin removal while reducing manufacturing time by eliminating the need for manual or mechanical cleaning operations.
Solution Approach 2:
The resin removal process transitions from a time-consuming mechanical operation to a controlled electrochemical process where parameters such as current density, electrolyte composition, and treatment duration can be optimized. This parameter control enables effective resin removal in a shorter, more predictable time frame.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the heat radiation efficiency and connection reliability by removing resin from the ditch and forming a plating film on the inner wall, thereby improving the overall reliability of the semiconductor device.
Implementation Method 1
a plating film is formed also on an inner wall of the first ditch in a process of forming the plating film on the lower surface of the chip mounting portion
Data Source
AI summary
The reliability of a semiconductor device is improved. In a manufacturing method of a semiconductor device, when resin enters a ditch formed on a lower surface of a chip mounting portion by a process of forming a sealing body made of the resin, the resin embedded in the ditch is removed by a process of cleaning the lower surface of the chip mounting portion, and a plating film is formed also on an inner wall of the ditch in a process of forming the plating film on the lower surface of the chip mounting portion.