Semiconductor Resin Sealing Layout to Suppress Peeling
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Solution Overview
Problem
Existing methods for suppressing peeling of sealing resin in semiconductor devices are costly and require significant processing effort, necessitating a simpler approach to enhance adhesion strength and prevent bubble entrapment.
Innovation Solution
A semiconductor device design featuring an insulating substrate with a metal pattern, semiconductor elements mounted on the pattern, wiring wires connected to the elements, and metal wires arranged around the elements on the pattern, with a distance between the semiconductor elements and metal wires greater than the element thickness, creating an anchor effect to enhance adhesion and prevent bubble entrapment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a convex mounting portion is formed by cutting, casting, or press working to suppress peeling of sealing resin, then adhesion strength is improved, but processing effort and costs increase
Solution Approach 1:
The invention extracts the essential function of the convex mounting portion (providing anchoring effect) and implements it through a simpler metal wire structure that follows the contour of the semiconductor element, eliminating the need for complex cutting, casting, or press working processes while maintaining the adhesion-enhancing function
Solution Approach 2:
The invention changes the geometric parameters of the sealing resin structure by creating a contour-following metal wire pattern that defines the shape of the sealing resin, allowing the sealing resin to naturally form anchoring features during filling without requiring post-processing mechanical modifications
2Strength
If metal wires are placed close to semiconductor elements to enhance adhesion, then anchoring effect is improved, but bubble entrapment during sealing resin filling increases
Solution Approach 1:
The invention applies local quality by positioning metal wires at specific locations that follow the contour of the semiconductor element, creating localized anchoring zones that enhance adhesion where needed while maintaining adequate spacing from the element body to prevent bubble entrapment during sealing resin filling
Solution Approach 2:
The invention transitions from a single-dimensional convex structure to a two-dimensional contour-following metal wire pattern, allowing the sealing resin to flow around and adhere to the element from multiple angles while maintaining safe distances that prevent bubble entrapment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses peeling of the sealing resin by enhancing adhesion strength and preventing bubble entrapment, while reducing processing costs and complexity.
Implementation Method 1
The adhesion strength between the sealing resin and the semiconductor element is enhanced by the anchor effect generated between the metal pattern and the sealing resin
Data Source
AI summary
An object is to provide a technique that suppresses peeling of a sealing resin that seals a semiconductor element by a simple method. A semiconductor device includes an insulating substrate provided with a front surface metal pattern a front surface thereof, a semiconductor element mounted on the front surface metal pattern, a wiring wire connected to the front surface electrode of the semiconductor element, a sealing resin that seals the insulating substrate and the semiconductor element, and at least one metal wire arranged around the semiconductor elements on and along the front surface metal pattern. The distance between the semiconductor element and the at least one metal wire is greater than the thickness of the semiconductor element.