Semiconductor Resin Segmentation for Crack Prevention
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Solution Overview
Problem
Conventional semiconductor devices face challenges such as cracks and chipping during the dicing process due to pressure application and contamination issues, and require different resin compositions for adhesion and insulation, complicating the manufacturing process and cleanliness control.
Innovation Solution
A semiconductor device with a first resin portion for insulation and a second resin portion for adhesion, differing in composition, is used, where the second resin portion is formed in trenches with narrower widths to enhance adhesion and prevent cracks, and the manufacturing method involves forming a first resin portion before dicing and a second resin portion in the trenches to facilitate clean and stable fractionization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the same resin is used for both adhesion and insulation in trenches, then the manufacturing process is simplified, but adhesion and insulation performance cannot be optimized simultaneously
Solution Approach 1:
The patent applies local quality by using different resin compositions in different regions: a first resin composition is used in the main body area for insulation, while a second resin composition is used specifically in the grip portions for adhesion. This allows each region to have optimized properties for its specific function, resolving the contradiction between manufacturing simplicity and performance optimization.
Solution Approach 2:
The resin structure is segmented into two distinct parts: the first resin portion for insulation and the second resin portion for adhesion. This segmentation allows independent optimization of each resin's properties for its specific function, enabling both adhesion and insulation performance to be maximized simultaneously.
2Strength
If trenches are formed before molding, then adhesion is improved, but cracks occur due to pressure application during resin charging
Solution Approach 1:
The patent applies preliminary action by forming the first resin portion (mold resin layer) over the semiconductor wafer before forming the trenches. This preliminary resin layer provides mechanical support and protection to the wafer, preventing cracks during subsequent pressure application when the second resin is charged into the trenches. The trenches are then formed through this protective resin layer, allowing adhesion improvement without compromising wafer integrity.
3Manufacturing precision
If inspection is performed before mold resin layer formation, then quality control is possible, but additional processing steps and cleanliness control are required
Solution Approach 1:
The patent merges the inspection function with the mold resin layer formation step. The first resin portion serves dual purposes: it acts as a protective layer during processing and simultaneously provides a medium for inspecting trench formation quality. By combining these functions, the patent eliminates the need for separate inspection steps and reduces cleanliness control requirements, as the resin layer protects the underlying structures from contamination.
Data Source
AI summary
The semiconductor device comprises a first area and a second area positioned adjacent to the outside of the first area, the semiconductor substrate having a main surface and side surfaces and disposed in such a manner that the main surface is positioned in the first area and each of the side surfaces is positioned at a boundary between the first area and the second area, a plurality of pads formed over the main surface of the semiconductor substrate and a plurality of external connecting terminals formed thereon, which are respectively electrically connected to the pads, a first resin portion which is formed over the main surface of the semiconductor substrate so as to cover the pads and has a main surface and side surfaces, and which is formed in such a manner that the external connecting terminals are exposed from the main surface and each of the side surfaces is positioned at the boundary, and a second resin portion which is positioned in the second area and formed so as to cover the side surfaces of the semiconductor substrate and the side surfaces of the first resin portion and which is different in composition from the first resin portion.