Semiconductor Device Resin Containment via Through Electrode Plating
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Solution Overview
Problem
Existing semiconductor devices face challenges in forming small-sized metal patterns with minimal space between them on a board, leading to issues with uncured resin or adhesive spreading beyond desired regions, which affects the size and reliability of LED packages and other semiconductor components.
Innovation Solution
A semiconductor device design featuring separate metal patterns with a through electrode between them, allowing for continuous plating and electric contact, which enables the formation of resin dams to contain uncured resins or adhesives within desired boundaries, thereby reducing the size of the device and maintaining precise control over resin spreading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thick metal patterns are formed by electroplating to generate step differences that stop resin spreading, then resin containment is improved, but device size and metal pattern width increase
Solution Approach 1:
The invention transitions from controlling resin spreading through horizontal metal pattern width to controlling it through vertical step differences created by electroplating. The through electrode provides a vertical reference point that enables precise control of metal pattern thickness, allowing resin containment through height rather than width.
Solution Approach 2:
The invention changes the critical parameter for resin containment from horizontal dimension (metal pattern width) to vertical dimension (electroplated metal thickness). By controlling the electroplating parameters, the step difference height is precisely controlled to stop resin spreading, while the metal pattern width can be minimized.
2Manufacturing precision
If multiple ring-shaped metal patterns are formed concentrically to create two-layered resin structure, then resin layer control is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The invention extracts the essential function of resin containment from the complex concentric ring structure. By using a single through electrode as a reference, the metal patterns can be formed with precise thickness control without requiring multiple concentric rings, simplifying the overall structure while maintaining manufacturing precision.
Solution Approach 2:
The through electrode serves as an intermediary reference structure that enables precise control of metal pattern thickness. This single vertical reference point replaces the need for multiple concentric metal patterns, simplifying the manufacturing process while achieving the same resin layer control function.
3Ease of manufacture
If via is provided immediately under metal pattern to supply electric current, then electroplating is enabled, but occupied area increases and board thickness is limited
Solution Approach 1:
The through electrode serves multiple functions: it acts as a mechanical support structure, provides electrical connection for electroplating, and serves as a vertical reference for controlling metal pattern thickness. This multi-functionality eliminates the need for separate via structures, reducing occupied area and removing board thickness limitations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the creation of small-sized semiconductor devices with reduced metal pattern widths and board thickness, effectively preventing resin or adhesive spread and enhancing the reliability and compactness of LED packages and similar components.
Implementation Method 1
The through electrode is disposed between the first metal pattern and the second metal pattern and penetrates through the board in the thickness direction
Implementation Method 2
A continuous plating layer may be disposed on the first metal pattern, the second metal pattern, and the through electrode
Implementation Method 3
surface tension of the uncured resin at a step of an edge of the metal pattern prevents the resin from wetting and spreading outwardly from the metal pattern
Data Source
AI summary
A small-sized semiconductor device with a structure for stopping and keeping uncured resin or adhesive in a desired region, which is manufactured by employing a process of curing uncured resin or adhesive that is made to wet and spread on a board, is provided. The semiconductor device includes a board mounted with a semiconductor element and includes metal patterns formed on the board. The metal patterns include a first metal pattern, a second metal pattern, and a through electrode. The first metal pattern and the second metal pattern are provided separately from each other on the board. The through electrode is disposed between the first metal pattern and the second metal pattern and penetrates through the board in the thickness direction.