Semiconductor Resin Layer Warping Control via Asymmetric Thermal Expansion
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Solution Overview
Problem
Semiconductor devices face warping due to thermal shrinkage during the curing process, leading to potential damage of function elements, and existing methods to prevent warping either increase device thickness or compromise visibility of markings on the back side resin layer.
Innovation Solution
A semiconductor device with a front side resin layer and a thinner back side resin layer made of a material with a higher thermal expansion coefficient, which absorbs stress equally, and a back side resin layer with filler mixed in a specific range to reduce surface luster and enhance visibility of markings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a back side resin layer with the same thickness as the front side resin layer is formed on the back surface of the wafer, then warping of the wafer can be prevented, but the thickness of the semiconductor device increases
Solution Approach 1:
The patent applies different thickness values to different parts of the resin layer structure. The back side resin layer is formed with a thickness different from the front side resin layer, creating a non-uniform thickness distribution that prevents warping while controlling overall device thickness. This local differentiation resolves the contradiction between warping prevention and thickness control.
2Illumination intensity
If filler is mixed in large amount in the resin material forming the back side resin layer, then the luster of the surface is reduced and markings become more visible, but the surface becomes greatly uneven
Solution Approach 1:
The patent optimizes the filler content parameter within a specific range (5-10 weight percent) to achieve the desired balance between reducing surface luster for marking visibility and maintaining surface uniformity. By precisely controlling this parameter, both requirements are satisfied simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents warping without increasing device thickness and improves visibility of markings by using a resin material with a higher thermal expansion coefficient and controlled filler content for the back side resin layer.
Implementation Method 1
the resin on the surface of the wafer thermally shrinks
Implementation Method 2
a back side resin layer which is made of the same material and has the same thickness as those of the front side resin layer is formed on the back surface of the wafer. Thereby, when the resins are cooled for curing after heating, the resins on the front surface and the back surface of the wafer thermally shrink in the same manner
Data Source
AI summary
Disclosed are a semiconductor device wherein warping of a semiconductor chip due to a sudden temperature change can be prevented without increasing the thickness, and a semiconductor device assembly. The semiconductor device comprises a semiconductor chip, a front side resin layer formed on the front surface of the semiconductor chip by using a first resin material, and a back side resin layer formed on the back surface of the semiconductor chip by using a second resin material having a higher thermal expansion coefficient than the first resin material. The back side resin layer is formed thinner than the front side resin layer.