Semiconductor Resistor With Fixed-Charge Dielectric Layer

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Solution Overview

Problem

In integrated circuits, achieving high precision in resistor resistance values is challenging due to limitations in reducing the width and depth of doped semiconductor regions, leading to variability in resistance values and increased random dopant fluctuations.

Innovation Solution

The introduction of a dielectric layer with high-k material and species creating fixed charges, such as lanthanum, barium, scandium, praseodymium, and aluminum, which provides a permanent electric field effect in the semiconductor region, allowing for precise control of charge carriers and ohmic resistivity between electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the width and depth of the doped semiconductor region are reduced to decrease resistor area, then the area required by the resistor is reduced, but the manufacturing precision and reliability of the resistance value deteriorate due to increased random dopant fluctuations and line roughness variability

Engineering Contradiction:
Improveresistor areaVSAvoidresistance value precision
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The patent changes the physical and chemical parameters of the dielectric layer by incorporating species that create fixed charges, thereby altering the electrical characteristics of the underlying semiconductor region. This allows precise control of carrier concentration and resistivity without changing the geometric dimensions of the resistor, resolving the contradiction between small area and high manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The dielectric layer with fixed charges acts as an intermediary between the metal interconnect and the semiconductor region. It provides a controlled electric field that modulates the carrier density in the semiconductor, enabling precise resistance control independent of the doped region's physical dimensions, thus allowing small resistor area while maintaining high precision.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the dopant concentration is reduced to provide high resistance values, then the resistor area can be reduced, but the reliability deteriorates due to increased random dopant fluctuations

Engineering Contradiction:
Improveresistance value stabilityVSAvoiddopant concentration
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent changes the mechanism for controlling resistance from dopant concentration to fixed charge density in the dielectric layer. By adjusting the amount and type of species (e.g., lanthanum, barium, scandium, aluminum) incorporated into the dielectric, precise control of carrier concentration is achieved without relying on statistical dopant distribution, thereby maintaining reliability while enabling high resistance values.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent substitutes the mechanical/diffusion-based dopant introduction process with an electric field-based control mechanism. Fixed charges in the dielectric layer create an electric field that attracts or repels carriers, providing deterministic control over resistance values without the statistical variations inherent in dopant concentration, thus improving reliability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If the distance L between electrical connections is increased to provide high resistance values, then the desired resistance can be achieved, but the resistor area increases

Engineering Contradiction:
Improveresistance value controlVSAvoidresistor area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent changes the primary control parameter for resistance from geometric dimension L to the electrical parameter of fixed charge density in the dielectric layer. This allows resistance values to be controlled by adjusting the concentration and polarity of fixed charges rather than increasing the distance between connections, thereby maintaining high resistance while minimizing resistor area.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the realization of high precision high ohmic resistors with consistent resistivity, reducing variability and improving manufacturing precision by creating a controlled electric field effect region.

Implementation Method 1

The dielectric layer includes a species creating fixed charges... providing a permanent electric field effect in the semiconductor region... allowing for precise control of charge carriers and ohmic resistivity

Methodology Applied
Scientific EffectElectric Field: Electric Field

Implementation Method 2

The dielectric layer includes a species creating fixed charges... providing a permanent electric field effect

Methodology Applied
Scientific EffectFixed Charges: Electrostatics

Data Source

PatentUS8823138B1Semiconductor resistor including a dielectric layer including a species creating fixed charges and method for the formation thereof
Publication Date: 2014.09.02 DAEDALUS ACQUISITIONS LLC
  • US8823138B1 patent drawing
  • US8823138B1 patent drawing
  • US8823138B1 patent drawing

AI summary

A semiconductor structure includes a resistor. The resistor includes a semiconductor region, a dielectric layer, a first electrical connection and a second electrical connection. The dielectric layer is provided on the semiconductor region and includes a high-k material having a greater dielectric constant than silicon dioxide. The dielectric layer includes a species creating fixed charges. A first electrical connection is provided at a first end of the semiconductor region and a second electrical connection is provided at a second end of the semiconductor region.