Semiconductor Module Retainer for Lead Electrode Alignment
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Solution Overview
Problem
High-power semiconductor device modules face challenges in achieving precise alignment of lead electrodes and power devices, leading to increased thermal displacement and reduced reliability due to the cantilevered structure and pressure sealing methods.
Innovation Solution
The semiconductor device module incorporates a retainer mechanism that restricts the movement of lead electrodes, improving positional precision and maintaining a favorable shape of the brazing filler metal, while reducing thermal displacement through the use of retainers engaged with the lead electrodes and integrated or separately formed with the resin case.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the lead electrode is cantilevered in the insulating case, then the ease of manufacture is improved, but the thermal displacement of the lead electrode increases
Solution Approach 1:
A retainer is introduced as an intermediary component between the lead electrode and the insulating case. The retainer supports the lead electrode at multiple points (including the tip and side surfaces) to restrict its movement, while the lead electrode remains cantilevered in the insulating case. This mediator resolves the contradiction by enabling both easy manufacture and high positional precision.
2Ease of manufacture
If the lead electrode is cantilevered, then the ease of manufacture is improved, but the thermal displacement due to heat increases
Solution Approach 1:
The retainer acts as a mediator that supports the lead electrode against thermal displacement. By providing mechanical support at multiple points, the retainer compensates for the thermal expansion and movement caused by heat generation during device operation, thereby maintaining reliability while preserving the ease of manufacture associated with cantilevered structures.
3Ease of manufacture
If pressure sealing is not used, then the cost is reduced, but the thermal displacement of the lead electrode cannot be reduced
Solution Approach 1:
The retainer serves as a cost-effective intermediary solution that provides thermal displacement control without requiring expensive pressure sealing processes. The retainer's mechanical support structure restricts lead electrode movement during thermal cycles, achieving precision control at lower cost by avoiding the need for pressure sealing equipment and processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability of the semiconductor device module by maintaining precise alignment and reducing thermal displacement, thereby alleviating stress on the devices and improving overall module reliability.
Implementation Method 1
the thermal displacement of the lead electrode will be presumably larger due to the heat generated in, for example, a power device
Implementation Method 2
one end of a lead electrode 40 is bonded to a top electrode 25 of a semiconductor device 20 with a brazing filler metal 35
Data Source
AI summary
The present invention relates to a semiconductor device module which includes: a semiconductor device including a top electrode and a bottom electrode; a substrate on which the bottom electrode of the semiconductor device is bonded; a heat sink on which the substrate is mounted; a lead electrode through which a main current of the semiconductor device flows; an insulating case disposed to enclose the substrate; and a retainer disposed in a cantilevered manner in the insulating case, the retainer supporting the lead electrode, wherein the lead electrode has one end brazed to the top electrode of the semiconductor device, and another end side inserted into a wall of the insulating case, and the retainer is engaged on the one end of the lead electrode to restrict movement of the lead electrode.