Semiconductor Rewiring Recess Structure to Prevent Protective Film Peeling
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Solution Overview
Problem
Existing semiconductor devices face challenges in maintaining the adhesive strength between the protective films and rewirings, leading to potential peeling issues that can compromise the integrity of the device.
Innovation Solution
The semiconductor device incorporates recesses in the rewiring surface to enhance the anchoring effect of the protective film, ensuring a robust adhesive strength through a specific aspect ratio and opening lengths that facilitate secure connections between the rewiring and protective films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a flat protective film is used to cover the rewiring, then the manufacturing process is simple, but the adhesive strength between the protective film and rewiring is insufficient leading to peeling
Solution Approach 1:
The rewiring surface is designed with curved recesses instead of a flat surface. The protective film conforms to these curved recesses, creating an anchoring effect that significantly enhances adhesive strength and prevents peeling between the protective film and rewiring.
2Strength
If the protective film is made thicker to improve adhesion, then adhesive strength increases, but the device height increases and miniaturization is compromised
Solution Approach 1:
Instead of increasing protective film thickness to improve adhesion, the invention uses curved recesses in the rewiring surface. This geometric feature provides mechanical anchoring that enhances adhesive strength while maintaining a compact device height suitable for miniaturization.
3Strength
If recesses are added to the rewiring surface to improve anchoring, then adhesive strength improves, but manufacturing precision requirements increase
Solution Approach 1:
The recesses are designed with smooth curved surfaces rather than complex geometric features. This curvature can be efficiently formed using standard semiconductor manufacturing techniques such as etching and deposition, achieving the anchoring effect while maintaining reasonable manufacturing precision requirements.
Data Source
AI summary
A semiconductor device includes: a main body including a semiconductor layer; an electrode located on one side of the main body in a thickness direction of the main body, and electrically connected to the semiconductor layer; a rewiring located on an opposite side of the main body with respect to the electrode in the thickness direction, and electrically connected to the electrode; a first protective film located on a same side as the rewiring with respect to the electrode in the thickness direction, and overlapping with the rewiring when viewed in the thickness direction; and a second protective film located between the main body and the first protective film in the thickness direction, wherein the rewiring has a facing surface facing the first protective film, wherein the facing surface has at least one recess, and wherein the first protective film is inserted into each of the at least one recess.