Semiconductor Package RF Shielding Against Digital Noise

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Solution Overview

Problem

The integration of RF, digital, and baseband chips in a single package leads to interference issues due to noise generated by digital circuitry, which disrupts RF systems, necessitating effective shielding solutions.

Innovation Solution

Embedding isolation layers of metal or appropriate materials around RF subsystems within the package to shield them from digital circuit noise, coupled to a common shielding ground, and routing interconnects through shield cut-outs to minimize crosstalk.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If multiple chips (RF, digital, baseband) are integrated into a single package, then system compactness and integration density are improved, but digital circuit noise interferes with RF system performance

Engineering Contradiction:

Improvepackage sizeVSAvoiddigital noise interference to RF

Core Design Contradiction:

Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent divides the package into distinct shielded regions by inserting metal isolation layers between different chip types. The isolation layers segment the package interior into RF-specific and digital-specific zones, preventing noise propagation while maintaining compact integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Metal isolation layers are introduced as intermediary elements between RF chips and digital chips. These isolation layers act as mediators that block electromagnetic noise from digital circuits from reaching sensitive RF circuits, enabling close proximity placement without interference.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If metal isolation layers are added to shield RF components, then RF performance is improved, but device complexity and manufacturing steps increase

Engineering Contradiction:

ImproveRF system performanceVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple functions into the metal isolation layers: they serve as both electromagnetic shields and structural support elements within the package. This merging reduces the need for separate shielding components, thereby limiting complexity growth despite adding shielding functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The metal isolation layers perform multiple functions simultaneously: electromagnetic shielding, mechanical support, and thermal management. This multi-functionality allows the package to achieve reliable RF performance without proportionally increasing device complexity, as a single component addresses multiple requirements.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively isolates RF components from digital noise, enabling compact system integration while maintaining RF performance.

Implementation Method 1

The isolation layer may be a metal isolation layer that is deposited over the RF die or under the digital die, or both. The metal isolation layer shields the RF die from digital circuit noise.

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS20250343568A1Radio frequency shielding within a semiconductor package

Publication Date: 2025.11.06 INTEL CORP

AI summary

Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.