Semiconductor Package Rigid Supporting Layer Mechanical Strength
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Solution Overview
Problem
Semiconductor packages with thinner semiconductor substrates face a reduction in mechanical strength, which compromises their ability to maintain electrical performance and withstand forces without breakage.
Innovation Solution
Incorporating a rigid supporting layer with a higher Young's modulus than the semiconductor substrate, made from materials like single crystal silicon, poly-crystal silicon, or silicon nitride, to enhance mechanical strength while maintaining a thinner substrate for improved electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor substrate thickness is reduced to less than one hundred microns, then the DC resistance decreases and electrical performance improves, but the mechanical strength of the semiconductor package decreases
Solution Approach 1:
The patent combines the semiconductor substrate with a rigid supporting layer to form a composite structure. The rigid supporting layer has a higher Young's modulus than the semiconductor substrate, providing enhanced mechanical strength while allowing the semiconductor substrate to maintain its reduced thickness for low DC resistance. This composite approach resolves the contradiction by allowing each layer to fulfill its primary function independently.
Solution Approach 2:
The patent addresses the mechanical strength issue by adding a dimension - the rigid supporting layer is positioned on the back surface of the semiconductor substrate, opposite to the circuit pattern surface. This dimensional addition provides structural reinforcement without interfering with the electrical performance of the thin semiconductor substrate.
2Strength
If a rigid supporting layer is added to increase mechanical strength, then the mechanical strength increases, but the device complexity increases
Solution Approach 1:
The patent utilizes reclaimed silicon wafers to fabricate the rigid supporting layer. This approach recovers and reuses materials that would otherwise be discarded, reducing waste and lowering manufacturing costs. The rigid supporting layer is formed from reclaimed silicon wafer material through appropriate processing, thereby decreasing device complexity from a material sourcing perspective.
Data Source
AI summary
A semiconductor wafer is singulated to form a plurality of semiconductor packages. The semiconductor wafer has a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer and a plurality of contact pads. A semiconductor package has a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer and a plurality of contact pads. A thickness of the rigid supporting layer is larger than a thickness of the semiconductor substrate. A thickness of the metal layer is thinner than the thickness of the semiconductor substrate. An entirety of the rigid supporting layer may be made of a single crystal silicon material or a poly-crystal silicon material. The single crystal silicon material or the poly-crystal silicon material may be fabricated from a reclaimed silicon wafer. An advantage of using a reclaimed silicon wafer is for a cost reduction.