Semiconductor Ring Assembly for Plasma Distribution and Polymer Control
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in reducing the deposition amount of polymer during plasma etching processes, which affects the efficiency and quality of semiconductor device production.
Innovation Solution
A ring assembly for semiconductor processes is introduced, comprising a focus ring, an outer ring, and a top ring, which surrounds the electrostatic chuck in the substrate processing apparatus. This configuration helps in controlling the plasma distribution and reducing polymer deposition on the outer ring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional single-ring structure is used, then the device complexity is low, but the polymer deposition control is insufficient
Solution Approach 1:
The ring assembly is divided into multiple independent rings (first ring, second ring, third ring) with different functions. The first ring controls plasma distribution, the second ring reduces polymer deposition on the substrate, and the third ring protects the outer ring from polymer accumulation. This segmentation allows each ring to address specific deposition control issues independently, achieving comprehensive polymer management without requiring a single complex structure.
Solution Approach 2:
The second ring acts as an intermediary element positioned between the substrate and the plasma environment. It intercepts polymer particles before they reach the substrate, reducing direct deposition. The third ring serves as a protective intermediary for the outer ring, preventing polymer accumulation on structural components. These intermediary rings mediate the interaction between plasma and substrate, controlling deposition patterns.
2Quantity of substance
If plasma distribution is not controlled, then the process is simple, but the deposition amount of polymer increases
Solution Approach 1:
The plasma control function is segmented across three rings with distinct roles. The first ring specifically manages plasma distribution patterns, while the second and third rings handle polymer deposition control at different locations. This segmentation of plasma control functions allows precise management of polymer formation and deposition without requiring a single complex plasma control mechanism.
Solution Approach 2:
Each ring is designed with specific local properties to address deposition issues in its region. The first ring has characteristics optimized for plasma distribution control, the second ring is positioned and configured for substrate protection, and the third ring is designed for outer ring protection. This local quality approach allows each component to address specific deposition control needs in its local environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed ring assembly effectively reduces the amount of polymer deposited during the semiconductor manufacturing process, thereby enhancing the production efficiency and quality of semiconductor devices.
Implementation Method 1
an electrostatic chuck (ESC) in the chamber and configured to support a substrate
Implementation Method 2
In a wafer etching process using plasma, a ring assembly for semiconductor process may be used to control distribution of plasma
Data Source
AI summary
Provided is a substrate processing apparatus including a chamber, an electrostatic chuck (ESC) in the chamber and configured to support a substrate, a shower head in the chamber and on the electrostatic chuck, and a ring assembly for a semiconductor process in the chamber and surrounding the electrostatic chuck, wherein the ring assembly for the semiconductor process includes a focus ring having a central axis extending in a first direction, an outer ring surrounding the focus ring, and a top ring on a top surface of the outer ring.