Semiconductor Packaging Defect Detection via Ring-Shaped Sensor
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Solution Overview
Problem
Defects such as cracks can be induced in the packaging structure of semiconductor devices during the formation of drill holes and fixing of cooling plates, which can lead to performance degradation or failure, and are difficult to detect due to being hidden by the cooling plates or redistribution layer.
Innovation Solution
A semiconductor device with a detecting component in a chain configuration, ring-shaped structure around the fixing component, integrated into the redistribution layer, allowing for electrical detection of defects like cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling plates are fixed to the packaging structure, then heat dissipation performance is improved, but defects such as cracks are induced in the packaging structure
Solution Approach 1:
A detecting component is integrated into the redistribution layer before the cooling plate is attached to the packaging structure. This detecting component is positioned to monitor the area where defects are most likely to occur during the subsequent cooling plate fixation process, enabling early detection of structural integrity issues
Solution Approach 2:
The detecting component provides real-time feedback on the condition of the packaging structure during and after cooling plate attachment. By monitoring electrical properties or physical changes in the redistribution layer, the system can detect cracks or defects induced by the fixation process, allowing for quality control and reliability assurance
2Ease of manufacture
If drill holes are formed in the packaging structure, then cooling plates can be fixed for heat dissipation, but defects such as cracks are induced during the process
Solution Approach 1:
The detecting component is embedded in the redistribution layer prior to drilling operations. This allows the detection system to be in place before the stressful drilling process begins, enabling monitoring of crack formation or structural degradation that occurs during hole formation
Solution Approach 2:
The detecting component acts as an intermediary between the drilling process and the final structural integrity assessment. It provides data about the condition of the packaging structure during manufacturing, bridging the gap between ease of manufacture (drilling) and reliability (structural integrity)
3Device complexity
If defects are hidden by cooling plates or redistribution layer, then device assembly is simplified, but defect detection becomes difficult
Solution Approach 1:
The detecting component is merged with the redistribution layer, forming an integrated structure that serves both electrical function and defect detection. This combination maintains the simplified assembly structure while enabling defect detection, as the detecting component is embedded within the existing redistribution layer rather than adding separate detection structures
Solution Approach 2:
The detecting component enables the packaging structure to self-monitor its own integrity. By embedding sensors within the redistribution layer, the structure performs self-detection of defects without requiring external inspection systems, maintaining assembly simplicity while solving the detection difficulty
Data Source
AI summary
A semiconductor device and a method for detecting a defect in a semiconductor device are provided. The semiconductor device includes a packaging structure. The packaging structure includes a redistribution layer and a detecting component disposed in the redistribution layer. The semiconductor device further includes a cooling plate over the packaging structure and a fixing component penetrating through the packaging structure and the cooling plate. The packaging structure and the cooling plate are fixed by the fixing component. The detecting component is in a chain configuration having a ring shaped structure circling around the fixing component.