Semiconductor Package Ring Structure to Reduce Warpage
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Solution Overview
Problem
The semiconductor industry faces challenges in managing thermal expansion mismatch between different materials in semiconductor packages, leading to stress, warpage, and potential delamination during manufacturing and usage.
Innovation Solution
The implementation of a ring structure composed of rigid materials, such as stainless steel, surrounding the semiconductor device, along with a cavity between the ring structure and the substrate, provides additional support and reduces thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a semiconductor device is mounted on a substrate, then electrical connectivity and functionality are achieved, but thermal expansion mismatch causes stress and warpage
Solution Approach 1:
The patent introduces a ring structure that segments the substrate into distinct regions: a first region with the semiconductor device, a second region with the ring structure, and a third region without either. This segmentation allows differential thermal expansion in each region, reducing overall stress and warpage while maintaining package reliability
Solution Approach 2:
The ring structure acts as an intermediary element between the semiconductor device and the substrate. It provides mechanical support and acts as a stress relief mechanism that accommodates thermal expansion mismatch, preventing direct transmission of stress between the device and substrate
2Area of stationary object
If the package size is reduced for compactness, then footprint is minimized, but thermal management becomes more challenging
Solution Approach 1:
The patent extends the thermal management solution from a two-dimensional plane to three dimensions by introducing a ring structure with vertical height. This ring structure provides additional thermal pathways and surface area for heat dissipation without increasing the horizontal footprint, effectively managing temperature in compact packages
3Strength
If rigid materials are used for the ring structure, then mechanical support is improved, but thermal stress from material mismatch increases
Solution Approach 1:
The patent carefully selects and controls the material parameters of the ring structure, specifically its coefficient of thermal expansion, to match or accommodate the substrate and semiconductor device. This parameter matching reduces thermal stress while maintaining the mechanical strength provided by rigid materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the semiconductor package by reducing warpage and the risk of underfill cracking, thereby improving the overall quality and performance of the package.
Implementation Method 1
The semiconductor industry faces challenges in managing thermal expansion mismatch between different materials in semiconductor packages, leading to stress, warpage, and potential delamination during manufacturing and usage
Data Source
AI summary
A semiconductor package includes a substrate, a semiconductor device, and a ring structure. The semiconductor device disposed on the substrate. The ring structure disposed on the substrate and surrounds the semiconductor device. The ring structure includes a first portion and a second portion. The first portion bonded to the substrate. The second portion connects to the first portion. A cavity is between the second portion and the substrate.