Semiconductor Rinse Composition for Pattern Collapse and Bridge Defect Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor manufacturing processes face challenges such as resist pattern collapse, bridging defects, high surfactant content, shape variation, residue formation, and storage stability issues in semiconductor aqueous compositions, particularly during the refining of fine resist patterns.
Innovation Solution
A semiconductor aqueous composition comprising a surfactant with a monovalent anion part and a monovalent cation part, represented by a specific formula, and water, which reduces defects, prevents pattern collapse, minimizes surfactant amount, stabilizes pattern shape, reduces residue, lowers surface tension, and enhances storage stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If pure water is used for rinsing resist patterns, then the rinsing process is simple, but resist pattern collapse occurs due to surface tension
Solution Approach 1:
The patent changes the chemical composition parameters of the rinsing solution by incorporating specific surfactants (fluorinated alkyl carboxylic acids and/or fluorinated alkyl sulfonic acids) with defined molecular structures and concentrations (0.01-5 wt%). This modifies the surface tension characteristics of the rinsing solution, enabling effective pattern protection without compromising process simplicity
Solution Approach 2:
The patent introduces surfactant molecules as intermediary substances between the rinsing water and the resist pattern. These surfactants adsorb at the liquid-solid interface, forming a protective layer that reduces surface tension forces acting on the pattern while allowing the rinsing process to proceed
2Manufacturing precision
If conventional surfactants are used to prevent pattern collapse, then pattern integrity is improved, but surfactant content becomes excessively high causing defects
Solution Approach 1:
The patent specifies precise molecular structure parameters for the surfactants (fluorinated alkyl carboxylic acids and/or fluorinated alkyl sulfonic acids) and controls their concentration within a narrow range (0.01-5 wt%). This optimized parameter selection achieves effective pattern protection with minimal surfactant content, preventing the harmful effects of excessive surfactant accumulation
Solution Approach 2:
The patent employs composite surfactant systems combining fluorinated alkyl carboxylic acids and/or fluorinated alkyl sulfonic acids with specific molecular structures. This composite approach enhances surfactant efficiency, allowing lower overall concentrations while maintaining effective pattern protection
3Manufacturing precision
If high surfactant content is used to reduce surface tension, then pattern collapse is prevented, but bridge defects increase in complicated circuits
Solution Approach 1:
The patent optimizes the molecular structure parameters of the surfactants (specifically fluorinated alkyl carboxylic acids and/or fluorinated alkyl sulfonic acids) and controls their concentration (0.01-5 wt%) to achieve balanced surface tension reduction. This prevents both pattern collapse and bridge defects by avoiding excessive surfactant accumulation that would cause bridging in narrow spaces
Solution Approach 2:
The patent's surfactant system provides localized protection where needed most. The fluorinated surfactants preferentially adsorb at critical interfaces and narrow spaces between pattern walls, providing enhanced protection in high-risk areas while maintaining lower overall concentrations that prevent bridge defects
4Ease of manufacture
If conventional rinsing solutions are used, then the process is simple, but residue remains after composition removal
Solution Approach 1:
The patent changes the chemical composition parameters by using specific fluorinated surfactants with defined molecular structures and controlled concentrations. These surfactants provide optimal solubility and rinsing characteristics that enable complete removal without residue, while maintaining process simplicity through straightforward formulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively reduces defects, prevents pattern collapse, minimizes surfactant usage, stabilizes pattern shape, reduces residue, lowers surface tension, and improves storage stability, thereby enhancing the reliability and efficiency of semiconductor manufacturing processes.
Implementation Method 1
The resist pattern collapse is considered to occur also when a negative pressure is generated between the patterns due to the surface tension of pure water when the patterns are washed with pure water after development
Implementation Method 2
a surfactant having a monovalent specific anion part and a monovalent cation part
Data Source
AI summary
[Problem] To provide a semiconductor aqueous composition capable of preventing a pattern collapse and suppressing a bridge defect. [Means for Solution] A semiconductor aqueous composition comprising a single or plurality of surfactant(s) having a monovalent anion part represented by formula (I): Chain 1-X1—X2-Chain 2 (I) wherein, X1 and X2 are each independently —C(=0)- or —S(=0)2-, and Chain 1 and Chain 2 are each independently a linear or branched C1-20 alkyl, wherein one or more H in said C1-20 alkyl are replaced by F, and one or more methylenes in Chain 1 may be replaced by -0-, with the proviso that Chain 1 and Chain 2 may be bonded to form a ring structure) and a monovalent cation part other than hydrogen ion; and water.