Semiconductor Rod Separation With Dual-Hardness Supports
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Solution Overview
Problem
The existing methods for manufacturing light-emitting elements, particularly inorganic light-emitting diodes, face challenges in minimizing crystal defects and achieving uniformity in the length and shape of semiconductor crystals, leading to suboptimal performance and quality in display devices.
Innovation Solution
A method involving the use of supports with different hardnesses to surround and separate semiconductor rods, including a first support with higher hardness for initial separation and a second support with lower hardness for subsequent separation, to minimize damage and ensure uniformity and smoothness of the light-emitting elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single support structure is used for separating semiconductor rods from the base substrate, then the separation process is simplified, but crystal defects increase and the shape of semiconductor crystals becomes rough due to damage during separation
Solution Approach 1:
The support structure is divided into two distinct parts: a first support that remains on the base substrate during initial separation, and a second support that is removed after transfer. This segmentation allows each support to serve a specific function - the first support enables controlled separation while the second support protects the transferred rods during removal from the base substrate, thereby reducing crystal defects and improving shape precision without significantly complicating the overall process
Solution Approach 2:
The first support is pre-formed on the base substrate before the transfer process begins. This preliminary structure provides a controlled interface for separating semiconductor rods from the base substrate, ensuring that separation occurs in a manner that minimizes mechanical stress and crystal damage, thus improving manufacturing precision while maintaining process simplicity
2Device complexity
If conventional transfer methods are used without dual support structures, then the manufacturing process is simpler, but uniformity in length and shape of light-emitting elements deteriorates
Solution Approach 1:
The support structure is divided into two distinct parts: a first support that remains on the base substrate during initial separation, and a second support that is removed after transfer. This segmentation allows each support to serve a specific function - the first support enables controlled separation while the second support protects the transferred rods during removal from the base substrate, thereby reducing crystal defects and improving shape precision without significantly complicating the overall process
Solution Approach 2:
The first support is pre-formed on the base substrate before the transfer process begins. This preliminary structure provides a controlled interface for separating semiconductor rods from the base substrate, ensuring that separation occurs in a manner that minimizes mechanical stress and crystal damage, thus improving manufacturing precision while maintaining process simplicity
Data Source
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AI summary
Provided are a method for manufacturing a light-emitting element, and a display device comprising the light-emitting element. The method for manufacturing a light-emitting element comprises: a step of preparing a base substrate and at least one semiconductor rod formed on the base substrate; a first separating step of forming a first element structure, which includes the semiconductor rod and a first support formed to encompass the outer surface of the semiconductor rod, and separating the first element structure from the base substrate; a step of removing at least a part of the first support so as to partially expose the semiconductor rod, and forming a second element structure which includes the exposed semiconductor rod and a second support encompassing the outer surface of the first support; and a second separating step of separating the semiconductor rod from the second element structure.