Semiconductor Apparatus Rounded Concave Portions
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Solution Overview
Problem
Semiconductor apparatuses with concave portions for increased creepage distance face stress concentration due to thermal expansion differences between metal plates and sealing resin, potentially leading to resin cracking.
Innovation Solution
A semiconductor apparatus design featuring concave portions recessed toward the side of semiconductor elements with a rounded shape, reducing stress concentration and improving insulation characteristics without increasing the device size, and a resin injection process with a gate at a corner portion to minimize resin flow obstacles and voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a concave portion is provided in the sealing resin to increase creepage distance, then insulation characteristics are improved, but stress concentration occurs at the concave portion due to thermal expansion differences
Solution Approach 1:
The concave portion is designed with a rounded shape instead of sharp corners, which distributes stress more evenly and prevents stress concentration at the concave portion while maintaining the increased creepage distance for improved insulation characteristics
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The rounded concave portions effectively distribute stress and reduce thermal expansion-induced stress, enhancing the durability and reliability of the semiconductor apparatus by preventing resin cracking and improving insulation, while the optimized resin flow reduces voids and exfoliation.
Implementation Method 1
heat generated by the semiconductor elements causes a stress concentration at the concave portion
Data Source
AI summary
A semiconductor apparatus is disclosed, which includes a semiconductor element provided on a plane; a sealing resin that seals the semiconductor element; a terminal that is electrically connected to the semiconductor element and includes a part that projects from a predetermined surface of the sealing resin; and a concave portion that is recessed toward a side of the semiconductor element from the predetermined surface, when viewed in a direction perpendicular to the plane. A side of the concave portion on the side of the semiconductor element includes a rounded shape, when viewed in the direction perpendicular to the plane.