Analytical Semiconductor Sample Polishing via Rotating Plate
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Solution Overview
Problem
Conventional methods for manufacturing analytical semiconductor samples, such as FIB and CMP, face challenges in creating wide viewing surfaces efficiently and environmentally, leading to increased manufacturing time and feedback delays due to limitations in beam size and environmental concerns.
Innovation Solution
A method and apparatus utilizing a rotatable support with a polishing plate and DI water nozzles to grind semiconductor samples, allowing for environment-friendly and large-area surface preparation by adjusting tilt directions and angles to achieve the desired viewing surface, minimizing feedback time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If FIB method is used to prepare viewing surface, then manufacturing precision is improved, but productivity deteriorates due to small beam size and long processing time
Solution Approach 1:
The patent replaces the FIB method (which uses ion beams) with a mechanical polishing system that uses a rotating polishing plate with abrasive particles. This mechanical approach processes larger areas simultaneously, dramatically improving productivity while maintaining viewing surface quality through controlled abrasion and real-time monitoring.
Solution Approach 2:
The patent introduces real-time image capture and feedback control to the polishing process. By adding the dimension of optical monitoring and automated adjustment, the system maintains high precision without sacrificing productivity, as the feedback loop continuously optimizes the polishing parameters.
2Productivity
If CMP method is used to prepare viewing surface, then productivity is improved by processing large areas, but environmental harm increases due to chemical slurry usage
Solution Approach 1:
The patent changes the chemical parameter of the polishing medium by replacing chemical slurry with a mechanical polishing system using abrasive particles on a rotating plate. This parameter change eliminates harmful chemicals while maintaining the ability to process large areas efficiently, thus improving productivity without environmental harm.
Solution Approach 2:
The patent converts the potentially harmful chemical polishing process into a beneficial mechanical process. By using mechanical abrasion with controllable parameters instead of chemical reactions, the system achieves the same productivity benefits without the environmental costs of chemical slurry disposal.
3Ease of manufacture
If mechanical polishing with sandpaper is used, then ease of manufacture is improved, but manufacturing precision deteriorates due to surface roughness
Solution Approach 1:
The patent introduces dynamic elements to the polishing system: the polishing plate rotates at controlled speeds, and the system incorporates real-time feedback with automated adjustment of polishing parameters. This dynamic control maintains ease of manufacture while dramatically improving surface smoothness and viewing surface quality compared to static sandpaper polishing.
Solution Approach 2:
The patent implements a feedback control system where the viewing surface is imaged in real-time during polishing, and the system automatically adjusts polishing parameters based on the captured images. This feedback loop maintains manufacturing simplicity while achieving high precision surface quality that static methods cannot provide.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables rapid and environmentally friendly production of large-area viewing surfaces for analytical semiconductor samples, reducing manufacturing time and improving process capability compared to conventional methods.
Implementation Method 1
grinding the analytical semiconductor samples with the upper surface of the polishing plate during the rotating
Implementation Method 2
discharging deionized (DI) water to an upper surface of the polishing plate through a DI water nozzle
Data Source
AI summary
There is provide a method for manufacturing analytical semiconductor samples by using an apparatus for manufacturing analytical semiconductor samples, which minimizes a feedback time by manufacturing a viewing surface that is environment-friendly and has a large area. The method comprising mounting the analytical semiconductor samples to a holder; discharging deionized (DI) water to an upper surface of a polishing plate through a DI water nozzle; grinding the analytical semiconductor samples with the upper surface of the polishing plat; determining whether a desired viewing surface of the analytical semiconductor samples has been acquired after the grinding of the analytical semiconductor samples; and transferring the analytical semiconductor samples to analyze the viewing surface of the ground analytical semiconductor samples based on a determination that the desired viewing surface of the analytical semiconductor samples has been acquired.