Semiconductor Seal Ring and Ring Barrier for Dicing Protection
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Solution Overview
Problem
Existing integrated circuit manufacturing processes face challenges in protecting the semiconductor structure during wafer dicing and packaging, leading to potential damage and reliability issues due to the lack of effective structural reinforcement and encapsulation of critical components.
Innovation Solution
The semiconductor structure incorporates a seal ring structure and a ring barrier made of conductive materials, surrounded by a mold material, which prevents encapsulation by the molding compound and provides structural reinforcement, thereby protecting the integrated circuit component during the dicing process and enhancing operational reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the semiconductor structure is processed without additional protective structures, then the manufacturing process is simpler, but the structure is vulnerable to damage during wafer dicing and packaging
Solution Approach 1:
The seal ring structure and ring barrier are formed before the wafer dicing and packaging processes. The seal ring structure is created by depositing conductive material and patterning it to form a protective ring around the contact pad area. The ring barrier is subsequently formed to protect the conductive via. These preliminary protective structures prevent damage during subsequent manufacturing steps while maintaining process integration.
Solution Approach 2:
The protective structure is divided into two functional segments: the seal ring structure that protects the contact pad region, and the ring barrier that protects the conductive via. This segmentation allows each component to perform its specific protective function independently, with the seal ring preventing molding material intrusion at the contact pad level and the ring barrier providing additional protection at the via level.
2Ease of manufacture
If molding material is allowed to encapsulate the seal ring and conductive contact pad, then the packaging is more complete, but the operational reliability is compromised
Solution Approach 1:
The seal ring structure acts as an intermediary barrier between the molding material and the conductive contact pad. It is positioned such that the molding material can flow around it during packaging, but the seal ring prevents the material from directly contacting and encapsulating the contact pad. This intermediary structure maintains the boundary between the molded and unmolded regions while protecting the electrical contact integrity.
Solution Approach 2:
The seal ring structure is formed in advance to prevent (anti-action) the harmful effect of molding material encapsulation. By creating this protective barrier before the molding process, the design preemptively counteracts the potential damage that would occur if molding material were to contact the contact pad, thereby preserving operational reliability while still allowing complete packaging.
Data Source
AI summary
A semiconductor structure has an integrated circuit component, a conductive contact pad, a seal ring structure, a conductive via, a ring barrier, and a mold material. The conductive contact pad is disposed on and electrically connected with the integrated circuit component. The seal ring structure is disposed on the integrated circuit component and surrounding the conductive contact pad. The conductive via is disposed on and electrically connected with the conductive contact pad. The ring barrier is disposed on the seal ring structure. The ring barrier surrounds the conductive via. The mold material covers side surfaces of the integrated circuit component. A semiconductor manufacturing process is also provided.