Semiconductor Structure Seal Ring Protection

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Solution Overview

Problem

The miniaturization of semiconductor devices leads to increased complexity in manufacturing, resulting in issues such as poor structural configuration, delamination, and yield loss, along with higher manufacturing costs due to challenges in protecting the devices from cracks and chippings during fabrication and singulation.

Innovation Solution

A semiconductor structure that includes a die, a molding surrounding the die, a first interconnect structure, a second interconnect structure, and a seal ring disposed within the second interconnect structure adjacent to its edge, which protects the die and interconnect structures from damages caused by cracks, chippings, or contaminants during fabrication or singulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the semiconductor device is miniaturized to increase functionality and integration, then the device size is reduced, but the manufacturing complexity increases leading to poor structural configuration and delamination

Engineering Contradiction:

Improvedevice sizeVSAvoidmanufacturing complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent divides the semiconductor device into distinct layers including a substrate layer, a first die layer, a molding layer, a second die layer, and an interconnect layer. Each layer is independently structured and can be manufactured separately before being integrated, which reduces the overall manufacturing complexity despite the miniaturized scale of the final device.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from planar 2D integration to 3D vertical stacking by positioning die layers at different heights and connecting them through vertical interconnect structures. This dimensional change allows increased functionality within a smaller footprint while maintaining manageable manufacturing processes for each layer.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If multiple components are assembled on a single semiconductor device to increase functionality, then the integrated circuitry is enhanced, but the structural configuration deteriorates causing delamination

Engineering Contradiction:

ImprovefunctionalityVSAvoidstructural configuration

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent combines multiple die layers, molding layers, and interconnect structures into a single integrated semiconductor device. The molding layer acts as a unified structure that encapsulates and bonds the die layers together, maintaining structural integrity while enabling multiple components to function together on a single device.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent employs composite material structures where different materials (substrate material, die material, molding material, interconnect material) are strategically combined in layered configurations. Each material is selected for its specific properties, and their composite arrangement provides both the functionality needed for multiple components and the structural stability to prevent delamination.

Inventive Principle:

Principle #40Composite materials

3Productivity

If manufacturing operations are increased within a small semiconductor device to enhance functionality, then the integrated circuitry is improved, but the yield loss increases due to cracks and chippings

Engineering Contradiction:

Improveintegrated circuitryVSAvoidyield loss

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent incorporates a molding layer that surrounds and protects the die layers and interconnect structures before final device completion. This molding structure acts as a cushioning element that absorbs mechanical stresses and prevents crack propagation during subsequent manufacturing operations, singulation, and handling, thereby reducing yield loss from defects.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

4Volume of moving object

If the device is miniaturized to reduce size, then the form factor is improved, but the manufacturing cost increases due to protection requirements

Engineering Contradiction:

Improvedevice sizeVSAvoidmanufacturing cost

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The molding layer serves multiple functions simultaneously: it provides structural support for the miniaturized die layers, acts as a protective barrier against cracks and chippings, facilitates heat dissipation, and enables electrical isolation between different interconnect structures. This multi-functionality reduces the need for additional separate protection components, thereby controlling manufacturing costs despite the miniaturized scale.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS11195804B2Semiconductor structure

Publication Date: 2021.12.07 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor structure includes a first interconnect structure, a second interconnect structure, a molding, a first seal ring and a second seal ring. The molding surrounds the die. The molding and the die are disposed between the first interconnect structure and the second inter connect structure. The first seal ring is disposed in the first interconnect structure. The second seal ring is disposed in the second interconnect structure.