Semiconductor Seal Ring Structure for Low-Cost Scribe Processing

Solution Overview

Problem

The existing semiconductor manufacturing process is costly due to the need for a laser pre-cutting process to remove insulating layers at the scribe region, and it is prone to delamination during chemical processes.

Innovation Solution

A method is introduced that eliminates the insulating layer at the scribe line region, thereby eliminating the need for laser pre-cutting and reducing production costs, while using a stair-like configuration of insulating and conductive layers to prevent delamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If insulating layers are removed at the scribe region to eliminate laser pre-cutting, then production cost is reduced, but delamination occurs during chemical processes

Engineering Contradiction:

Improveproduction costVSAvoiddelamination resistance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The insulating structure is divided into multiple segments: a first insulating layer covering the chip region, and a second insulating layer covering the scribe region. This segmentation allows each layer to serve its specific function - the first layer provides insulation where needed, while the second layer prevents delamination at the scribe region during chemical processes, eliminating the need for costly laser pre-cutting

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different insulating layers are applied to different regions of the semiconductor substrate. The first insulating layer is positioned over the chip region where electrical insulation is critical, while the second insulating layer is positioned over the scribe region where delamination prevention is the primary concern. This local differentiation optimizes both cost and reliability

Inventive Principle:

Principle #3Local quality

2Reliability

If insulating layers are retained at the scribe region to prevent delamination, then reliability is improved, but laser pre-cutting is required increasing production cost

Engineering Contradiction:

Improvedelamination resistanceVSAvoidproduction cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The insulating structure is divided into multiple segments: a first insulating layer covering the chip region, and a second insulating layer covering the scribe region. This segmentation allows each layer to serve its specific function - the first layer provides insulation where needed, while the second layer prevents delamination at the scribe region during chemical processes, eliminating the need for costly laser pre-cutting

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The harmful function of the insulating layer at the scribe region (requiring laser removal) is extracted by replacing it with a specialized second insulating layer that provides delamination protection without requiring subsequent removal, thereby eliminating the laser pre-cutting step and reducing production costs

Inventive Principle:

Principle #2Taking out (Extraction)

Data Source

PatentUS12469800B2Semiconductor device

Publication Date: 2025.11.11 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A device includes a molding compound, a plurality of through vias, a seal ring structure, and a protection layer. The plurality of through vias are embedded in the molding compound. The seal ring structure is over the molding compound and surrounds the through vias in a top view. The protection layer covers the seal ring and extends toward the molding compound in a cross-sectional view.