Semiconductor Package Sealing Structure Against Moisture Ingress
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Solution Overview
Problem
Conventional semiconductor devices face reliability issues due to moisture intrusion through the interface between terminal members and sealing members, leading to degradation of semiconductor elements.
Innovation Solution
A semiconductor device design that includes a base member, a case with a support portion, a wiring board, and a sealing member, where the wiring board is positioned to overlap with the semiconductor element and the terminal member is connected to the outer peripheral edge of the wiring board, with the support portion contacting the inner edge of the wiring board, forming a seal to prevent moisture ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the terminal member extends from the wiring board to the outside of the sealing member, then the electrical connection is achieved, but moisture can enter along the interface between the terminal member and sealing member
Solution Approach 1:
The patent introduces a support portion as an intermediary element between the sealing member and the wiring board. This support portion contacts the inner edge of the wiring board and extends toward the terminal member, creating an additional barrier that interrupts the moisture intrusion path along the terminal member interface, thereby preventing moisture from reaching the semiconductor element
2Reliability
If the wiring board is positioned to overlap with the semiconductor element, then the electrical connection is achieved, but the moisture intrusion path is extended
Solution Approach 1:
The patent segments the sealing structure by introducing a support portion that divides the sealing member into multiple regions. This segmentation creates separate moisture intrusion paths, forcing moisture to navigate around the support portion rather than following a direct path, thereby effectively increasing the moisture intrusion path length and reducing the likelihood of moisture reaching the semiconductor element
Data Source
AI summary
A highly reliable semiconductor device and power conversion device are obtained. In the semiconductor device, a semiconductor element is mounted on a main surface of a base member. A case includes a side wall surrounding the base member. A support portion is formed on an inner peripheral surface of the side wall on a side of the base member. At least a part of the support portion is in contact with a contact region located inside an outer peripheral end of wiring board on a surface of the wiring board located on the side of the semiconductor element. A sealing member seals the semiconductor element and the wiring board. A terminal member is connected to a region of the wiring board closer to the outer peripheral end than the contact region. The terminal member includes an end portion protruding from a surface of the sealing member.