Semiconductor Sealing Insulator Structure for Stress-Stable Electrodes
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Solution Overview
Problem
Current semiconductor devices with wide bandgap semiconductors face challenges in achieving optimal mechanical strength and reliability due to stress-induced deformations and fluctuations in electrical characteristics, particularly when using thick sealing insulators and large planar area terminal electrodes.
Innovation Solution
A semiconductor device design incorporating a sealing insulator with a high filler content matrix resin and flexible particles, which enhances mechanical strength and suppresses stress-induced deformations, combined with a laminated structure for the terminal electrodes to improve reliability and protect against external forces and humidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thick sealing insulators are used to protect terminal electrodes, then protection against external forces and humidity is improved, but stress-induced deformations increase causing fluctuations in electrical characteristics
Solution Approach 1:
The patent changes the physical and chemical parameters of the sealing insulator by incorporating fillers with specific particle sizes (0.1-10 μm), controlling filler content (30-90 wt%), and adjusting the elastic modulus through material composition. These parameter changes optimize the balance between protective function and stress induction, reducing fluctuations in electrical characteristics while maintaining reliability.
Solution Approach 2:
The patent uses composite materials consisting of resin matrices combined with inorganic fillers (such as glass beads, glass flake, or ceramic particles). This composite structure provides both the protective function against external forces and humidity while the filler materials help control stress induction, resolving the contradiction between protection and electrical stability.
2Reliability
If large planar area terminal electrodes are used to improve electrical performance, then electrical characteristics are improved, but stress-induced deformations increase affecting device reliability
Solution Approach 1:
The patent adjusts the elastic modulus of the sealing insulator by controlling filler type, content, and particle size distribution. This parameter optimization allows the sealing insulator to accommodate the large planar area terminal electrodes while minimizing stress-induced deformations, maintaining both electrical performance and mechanical strength.
Solution Approach 2:
The patent creates local quality differences in the sealing insulator by using fillers with specific particle sizes (0.1-10 μm) and distributions. This local optimization of material properties allows the sealing insulator to provide uniform support across large terminal electrode areas while maintaining overall mechanical strength and reducing deformations.
3Strength
If sealing insulators with high filler content are used to improve mechanical strength, then mechanical strength is improved, but manufacturing complexity increases
Solution Approach 1:
The patent optimizes the filler content parameter within the range of 30-90 wt% to achieve the desired mechanical strength while maintaining manufacturability. By establishing this specific parameter range, the patent balances mechanical strength improvement with manufacturing complexity control, avoiding excessive complexity while achieving the required strength levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves the mechanical strength of the sealing insulator and reduces stress-induced deformations, enhancing the reliability of the semiconductor device by protecting it from external forces and humidity while maintaining electrical performance.
Implementation Method 1
A semiconductor device design incorporating a sealing insulator with a high filler content matrix resin and flexible particles, which enhances mechanical strength and suppresses stress-induced deformations
Implementation Method 2
a laminated structure for the terminal electrodes to improve reliability and protect against external forces and humidity
Data Source
AI summary
A semiconductor device includes a chip that has a main surface, a main surface electrode that is arranged on the main surface, a terminal electrode that is arranged on the main surface electrode, a sealing insulator that covers a periphery of the terminal electrode on the main surface such as to expose a part of the terminal electrode, and that includes a matrix resin and fillers added into the matrix resin such that a ratio of a total cross-sectional area with respect to a unit cross-sectional area is higher than a ratio of a cross-sectional area of the matrix resin with respect to the unit cross-sectional area.