Semiconductor Press-Pack Device With Intermediate Sealing Wall
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Solution Overview
Problem
High operating temperatures in semi-conductor electronic devices can lead to deterioration, particularly in press-pack assemblies used in high-power electrical energy converters, where temperature peaks are not effectively managed by existing thermal and electrical conductive springs.
Innovation Solution
Incorporation of an intermediate electrically insulating sealing wall within the device to separate semi-conductor components from a circulating cooling liquid, which facilitates improved heat dissipation while maintaining electrical connectivity through electrically conductive elastic parts and a dual cooling liquid circulation system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If elastic parts (springs) are used to ensure simultaneous electrical transfer and thermal transfer, then electrical connectivity and thermal conduction are improved, but temperature peaks occur causing deterioration of semi-conductor components
Solution Approach 1:
The device is divided into two separate functional systems: an electrical conduction system (elastic parts) and a thermal conduction system (cooling liquid circulation channels). This segmentation allows each system to perform its specialized function optimally without the limitations of trying to achieve both electrical and thermal conduction through a single medium.
Solution Approach 2:
A cooling liquid is introduced as an intermediary substance to transfer heat away from the semi-conductor components. The cooling liquid circulates through dedicated channels, acting as a mediator that absorbs and removes thermal energy without interfering with the electrical conduction function of the elastic parts.
2Temperature
If cooling liquid is introduced to reduce temperature, then thermal management is improved, but electrical insulation and separation of components from cooling liquid are required
Solution Approach 1:
The housing structure serves multiple functions simultaneously: it provides mechanical support, contains the cooling liquid circulation channels, provides electrical insulation, and creates sealed compartments. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
Solution Approach 2:
The cooling liquid circulation channels are nested within the housing structure itself, with the housing walls forming the channels. This nesting approach integrates the cooling system into the existing structural framework rather than adding it as a separate external system.
3Reliability
If elastic parts are made electrically conductive for electrical transfer, then electrical connectivity is maintained, but thermal conduction capability is insufficient to prevent temperature peaks
Solution Approach 1:
The device is divided into two separate functional systems: an electrical conduction system (elastic parts) and a thermal conduction system (cooling liquid circulation channels). This segmentation allows each system to perform its specialized function optimally without the limitations of trying to achieve both electrical and thermal conduction through a single medium.
Solution Approach 2:
The patent replaces the mechanical/physical conduction approach (relying on conductive materials to transfer both electricity and heat) with a fluid-based thermal management system. Instead of trying to improve the thermal conduction properties of the elastic parts, the system uses flowing cooling liquid to actively remove heat, substituting passive conduction with active convection-based cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the maximum operating temperature of semi-conductor components, preventing deterioration and enhancing the reliability of high-power electronic devices by efficient heat elimination without disrupting their operation.
Implementation Method 1
the cooling liquid, adapted to circulate around the elastic parts, between the intermediate sealing wall and the supporting plate
Implementation Method 2
elastic parts, preferably electrically conductive, positioned between the semi-conductor components and a supporting plate
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
This semi-conductor electronic device (12) is intended for mounting in a pressed stack assembly. The device (12) comprises a box (20) comprising a lower plate (22), an upper plate (24) and a lateral wall (26) mechanically connecting the lower plate (22) to the upper plate (24), the lower (22) and upper (24) plates being electrically conductive, several semi-conductor components (28), each component (28) comprising a first electrode (42) and a second electrode (44), the first electrodes (42) being electrically connected to the lower plate (22) and the second electrodes (44) being electrically connected to the upper plate (24), and elastic parts (30) positioned between the components (28) and a supporting plate (24) chosen from the lower plate (22) and the upper plate (24). The device (12) comprises, in addition, an intermediate sealing wall (32) positioned inside the box (20), between the components (28) and the elastic parts (30), the intermediate sealing wall (32) electrically connecting the components (28), the intermediate sealing wall (32) being adapted to separate the components (28) from an electrically insulating cooling liquid, adapted to circulate around the elastic parts (30), between the intermediate sealing wall (32) and the supporting plate (24).