Semiconductor Device Segmented Die Pad Resin Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing SIP semiconductor devices face challenges with resin peeling between the mold resin and the die pad due to low adhesion, especially when downsizing the die pad, and alignment issues when mounting multiple chips side by side, as traditional methods like slits for resin injection and chip alignment are not effective.
Innovation Solution
The semiconductor device employs smaller die pads with bars and projections as marks between chips for alignment and resin injection, allowing easier resin flow beneath connecting wires and using recessed parts on the connection lead as alternative marks for alignment, ensuring reliable resin sealing and efficient chip alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the die pad is downsized to improve temperature cycle characteristics, then the temperature cycle characteristic is improved, but resin peeling occurs between the mold resin and the die pad due to low adhesion area
Solution Approach 1:
The die pad is divided into a mounting part for chip mounting and a coupling part that couples mounting parts. The coupling part has a smaller width than the mounting parts, creating a segmented structure that allows resin to flow into the space between die pad segments, improving adhesion without requiring a larger overall die pad size.
Solution Approach 2:
The invention introduces a width dimension differentiation between the mounting part and coupling part of the die pad. By making the coupling part narrower in the width direction while maintaining the mounting part size, it creates a three-dimensional resin flow path that enhances adhesion in the vertical direction without increasing the overall footprint.
2Temperature
If the die pad is downsized, then the temperature cycle characteristic is improved, but it becomes difficult to inject resin between the wire and die pad
Solution Approach 1:
The die pad is segmented into mounting parts and a narrower coupling part, creating gaps or spaces that facilitate resin injection between the wire and die pad structures during the encapsulation process.
Solution Approach 2:
The coupling part acts as an intermediary structure between the mounting parts, providing a pathway or channel for resin to flow and penetrate into the spaces between wires and the die pad, ensuring proper encapsulation.
3Ease of manufacture
If longitudinal slits are provided for resin injection, then resin can be injected between chips, but the device complexity increases and alignment marks are compromised
Solution Approach 1:
The coupling part of the die pad serves multiple functions: it couples the mounting parts together, provides alignment reference for chips, and creates pathways for resin injection. This eliminates the need for separate longitudinal slits while achieving resin injection capability.
Solution Approach 2:
The alignment mark function and resin injection pathway function are merged into the coupling part structure. The narrower width of the coupling part inherently creates the resin flow path while also serving as the alignment reference, eliminating the need for separate longitudinal slits.
4Temperature
If the die pad is downsized, then the temperature cycle characteristic is improved, but chip alignment becomes more difficult
Solution Approach 1:
The coupling part serves as both a structural element coupling the mounting parts and as an alignment reference for chip placement. This multi-functional design maintains alignment precision without requiring additional features on the downsized die pad.
Solution Approach 2:
The coupling part has a distinct asymmetric width relationship with the mounting parts (narrower coupling part), creating a unique geometric feature that serves as an alignment reference. This asymmetric geometry provides clear alignment cues for chip placement on the downsized die pad.
Data Source
AI summary
A semiconductor device comprises: a first and second die pads arranged side by side; a plurality of inner leads arranged around the first and second die pads; first and second chips mounted on the first and second die pads; a bar provided between the first and second chips and the plurality of inner leads, extending in an array direction of the first chip and the second chip; a plurality of wires that connect the first and second chips and the plurality of inner leads and connect the first chip and the second chip; and resin that seals the first and second die pads, the plurality of inner leads, the first and second chips, the plurality of wires and the bar, wherein the bar comprises a mark provided at a position corresponding to an area between the first chip and the second chip in an array direction of the first chip and the second chip.