Semiconductor Device with Segmented Lead Frame Plates
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Solution Overview
Problem
Conventional semiconductor devices face challenges in handling large currents while maintaining a compact size, as thick lead frames required for high current transmission complicate fine processing and lead to increased device size.
Innovation Solution
The semiconductor device design incorporates insulating substrates with separate conductor portions and terminals of varying thicknesses, using a support member with a thinner plate thickness to accommodate thick terminals, allowing for efficient current handling without enlarging the device size, and employs a sealing resin to secure components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the plate thickness of the lead frame is made large to allow large current to flow, then the current handling capability is improved, but the manufacturing precision deteriorates and the device size increases
Solution Approach 1:
The lead frame is divided into multiple independent plates (first lead frame plate, second lead frame plate, third lead frame plate) with different functions. The first and second plates have larger thickness for current handling, while the third plate has smaller thickness for precise positioning and support, resolving the contradiction between current capability and manufacturing precision.
Solution Approach 2:
Different regions of the lead frame structure have different plate thicknesses optimized for their specific functions. Current-carrying portions have larger thickness for low resistance, while support and positioning portions have smaller thickness for precision manufacturing and fine processing.
2Strength
If the plate thickness of the lead frame is made large to support pin terminals, then the structural strength is improved, but the device size increases
Solution Approach 1:
The support function is separated from the current-carrying function by dividing the lead frame into multiple plates. The third lead frame plate with smaller thickness is dedicated to supporting pin terminals, while the first and second plates handle current transmission, thereby reducing overall device size while maintaining support strength.
Solution Approach 2:
The first and second lead frame plates serve multiple functions: they provide structural support for pin terminals and simultaneously serve as current-carrying paths with larger thickness for low resistance, eliminating the need for a single thick plate for all purposes.
Data Source
AI summary
A semiconductor device includes: an insulating substrate; a first conductor portion and a second conductor portion that are formed on the insulating substrate; a semiconductor element disposed on the first conductor portion; a first terminal that is connected to a first electrode of the semiconductor element; a second terminal that is connected to the first conductor portion; a connection member electrically connecting a control electrode of the semiconductor element and the second conductor portion to each other; a support member that is disposed at a predetermined distance from the second conductor portion; a pin terminal having that is supported in a state of being inserted through the support member and connected to the second conductor portion; and a sealing resin that seals the insulating substrate, the first conductor portion, the second conductor portion, the semiconductor element, the connection member, and the support member.