Semiconductor Device Thermal Stress Reduction via Segmented Metal Column
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Solution Overview
Problem
Conventional semiconductor devices face reliability issues due to thermal stress caused by heat dissipation structures, which can lead to warpage and degradation, as they often expose heat dissipation members, resulting in reduced effectiveness of heat dissipation and reliability.
Innovation Solution
A semiconductor device design featuring a plate with a through hole and a metal column fixed with an insulating member, where the semiconductor element is supported by a projection of the metal column, and a package covers the element and heat dissipation member, exposing part of the plate to enhance heat dissipation while reducing thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat dissipation member is exposed from the package to improve heat dissipation, then heat dissipation effectiveness is improved, but thermal stress causes warpage and reliability degradation
Solution Approach 1:
The support structure is segmented into multiple columns instead of a single large die pad. This segmentation reduces the thermal mass and thermal deformation of the support structure, thereby reducing thermal stress on the semiconductor element while still providing effective heat dissipation pathways through each column to the heat dissipation member.
Solution Approach 2:
The patent applies local quality by providing heat dissipation columns only at specific locations where thermal stress needs to be managed, rather than using a large continuous die pad. The columns are strategically positioned to provide both mechanical support and thermal management at critical points, reducing overall thermal stress while maintaining effective heat dissipation.
2Reliability
If the semiconductor element is mounted on a large die pad to reduce thermal stress, then thermal stress is reduced, but heat dissipation effectiveness is reduced
Solution Approach 1:
The large die pad is replaced with multiple smaller heat dissipation columns that are distributed across the substrate. This segmentation provides sufficient mechanical support to reduce thermal stress on the semiconductor element while maintaining effective heat dissipation through the columns to the heat dissipation member.
Solution Approach 2:
The patent uses a composite structure combining the substrate, multiple heat dissipation columns, and an exposed heat dissipation member. This composite structure optimizes both mechanical support properties (to reduce thermal stress) and thermal conduction properties (to enhance heat dissipation) by integrating materials with different properties in a functional arrangement.
3Stability of the object's composition
If the entire surface of the semiconductor element is supported to reduce warpage, then warpage is reduced, but thermal stress increases due to thermal expansion differences
Solution Approach 1:
Instead of supporting the entire surface with a large die pad, the patent segments the support into multiple smaller columns. This provides sufficient mechanical support to prevent warpage while reducing the thermal mass and thermal deformation of the support structure, thereby reducing thermal stress on the semiconductor element.
Solution Approach 2:
The heat dissipation columns act as intermediaries between the semiconductor element and the substrate. These columns provide mechanical support to reduce warpage while their smaller thermal mass reduces thermal deformation, thereby mediating the thermal stress between the semiconductor element and the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces thermal stress and enhances heat dissipation, leading to improved reliability and performance of semiconductor devices by supporting the semiconductor element with a smaller surface area and using an insulating member for efficient heat transfer.
Implementation Method 1
an insulating member interposed therebetween
Implementation Method 2
another surface of the plate is exposed from the package
Implementation Method 3
another surface of the plate is exposed from the package
Data Source
AI summary
A semiconductor device according to the present disclosure includes: a plate (13) having a through hole (15); a metal column (16) fixed to the through hole with an insulating member (17) interposed therebetween, and having a projection projecting from the upper surface of the plate; a semiconductor element (12) fixed to the projection; a lead frame (11) electrically connected to the semiconductor element; and a package (14) covering the semiconductor element, and also covering at least part of each of the plate, the metal column, and the lead frame. The lower surface (13b) of the plate is exposed from the package.