Semiconductor Device With Segmented Molded Leads

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Solution Overview

Problem

The increasing integration of functions in semiconductor devices necessitates more efficient heat dissipation, improved reliability, reduced size, and decreased manufacturing costs, which existing packaging methods struggle to achieve effectively.

Innovation Solution

A semiconductor device design featuring multiple separate leads molded in a structured form with a chip attached over at least two leads, utilizing a molded structure that can include a cavity and various insulating layers for enhanced heat dissipation and mechanical support, and potentially using leadframes and specific mold materials like duroplast epoxy resin.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional packaging methods are used, then manufacturing simplicity is maintained, but heat dissipation efficiency deteriorates

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidpackaging structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent divides the packaging structure into multiple separate leads instead of a single integrated package body. Each lead acts as an independent heat dissipation pathway, allowing heat to be conducted away from the chip through multiple distributed channels, thereby improving heat dissipation efficiency without requiring a completely new packaging architecture.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from a traditional three-dimensional package body to a two-dimensional planar arrangement of multiple separate leads. This dimensional change allows heat to be dissipated across a larger surface area and enables better thermal coupling between the chip and heat sink while simplifying the overall packaging structure.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If chip size is reduced, then device size is decreased, but heat dissipation capability deteriorates

Engineering Contradiction:

Improvedevice sizeVSAvoidheat dissipation capability

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

By segmenting the heat dissipation function into multiple separate leads, the patent enables a smaller chip to achieve the same total heat dissipation capability as a larger chip would require in traditional packaging. Each lead handles a portion of the heat load, collectively providing sufficient thermal management for compact device designs.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent uses multiple copies of the same lead structure, each providing identical thermal conduction pathways. This replication allows heat dissipation capability to be scaled by simply adding more leads rather than increasing chip size, enabling compact device design while maintaining adequate heat dissipation.

Inventive Principle:

Principle #26Copying

3Temperature

If multiple separate leads are used, then heat dissipation is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The multiple separate leads serve dual functions: they provide electrical connections and simultaneously act as heat dissipation pathways. This multi-functionality eliminates the need for separate thermal management components, simplifying the manufacturing process despite the increased number of leads, as the same structures fulfill both electrical and thermal requirements.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Strength

If leads are molded in a structured form, then mechanical support is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvemechanical supportVSAvoidmolding precision

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent uses a molded structure that combines the leads with a supporting matrix material. This composite construction provides enhanced mechanical support and structural integrity to the individual leads, allowing them to maintain their heat dissipation function while gaining the mechanical strength needed for reliable device assembly and operation.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances heat dissipation, mechanical support, and reliability while reducing manufacturing costs by optimizing the interaction between the chip and leads, allowing for efficient thermal management and structural integrity.

Implementation Method 1

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7868430B2Semiconductor device

Publication Date: 2011.01.11 INFINEON TECHNOLOGIES AG

AI summary

This application relates to a semiconductor device comprising multiple separate leads molded in a molded structure, and a chip attached to the molded structure over at least two of the multiple separate leads.