Semiconductor Wide Band Impedance Matching Using Segmented Signal Lines
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Solution Overview
Problem
Current semiconductor devices are inadequate for wide band impedance matching, particularly at high frequencies up to 10 GHz or higher, due to insufficient studies on impedance matching in such frequency ranges.
Innovation Solution
A semiconductor device design featuring an insulation substrate with a ground pattern, a semiconductor element, an input terminal, a 1st signal line, a 2nd signal line with lower impedance, and a capacitor connected to the 2nd signal line, where the 1st and 2nd signal lines have different impedances and the capacitor is strategically positioned to enhance impedance matching across a broader frequency range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional single signal line is used for impedance matching, then the structure is simple, but the impedance matching bandwidth is limited and cannot achieve wide band matching up to high frequencies
Solution Approach 1:
The signal transmission path is divided into multiple segments: a first signal line with first impedance connected to the semiconductor element, and a second signal line with second impedance connected to the input terminal. This segmentation allows each segment to be optimized for different frequency ranges, achieving wide band impedance matching while maintaining manageable structural complexity
Solution Approach 2:
Different impedance values are assigned to different parts of the signal transmission path. The first signal line has a specific impedance optimized for high-frequency signals from the semiconductor element, while the second signal line has a different impedance optimized for the input terminal interface. This local differentiation of electrical properties enables broad bandwidth matching
2Adaptability or versatility
If a capacitor is added to the signal line to improve impedance matching, then the impedance matching performance improves, but the device size increases
Solution Approach 1:
The capacitor is integrated directly into the second signal line structure, forming a combined conductor-capacitor assembly. The capacitor includes a first metal pattern and a second metal pattern that are electrically coupled, with the second metal pattern positioned between the first metal pattern and the ground pattern. This merging eliminates the need for separate discrete capacitor components, improving impedance matching while minimizing device area
Solution Approach 2:
The capacitor is formed using planar metal patterns on the insulation substrate surface rather than vertical stacked capacitors or discrete components. The first metal pattern extends along the longitudinal direction of the second signal line, creating capacitance through surface area in the planar dimension. This dimensional approach reduces the vertical profile and overall device footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves wide band impedance matching up to higher frequencies by utilizing signal lines with different impedances and a capacitor that provides distributed capacitance, effectively minimizing size and optimizing electrical characteristics.
Implementation Method 1
a capacitor connected to the 2nd signal line and provided on the insulation substrate. The capacitor includes a 1st metal pattern provided on the insulation substrate so as to connect to the 2nd signal line and extend along a longitudinal direction of the 2nd signal line
Data Source
AI summary
A 2nd signal line has impedance lower than impedance of a 1st signal line. A capacitor includes a 1st extension part and a 2nd extension part, a 1st ground part and a 2nd ground part. The 1st extension part and the 2nd extension part are connected to a 2nd signal line and are on an insulation substrate to extend along a longitudinal direction of the 2nd signal line. The 1st ground part and the 2nd ground part are at least a part of a ground pattern, and are between the 1st extension part and the 2nd extension part and the 2nd signal line, and between the 1st extension part and the 2nd extension part and an end part of the insulation substrate, to be electrically coupled with the 1st extension part and the 2nd extension part.