Semiconductor Device Segmented Wiring for Current Distribution
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Solution Overview
Problem
Semiconductor devices experience abnormal overheating due to increased rated current, leading to reliability issues, as existing configurations result in uneven current flow and heat distribution, causing overheating in wiring members.
Innovation Solution
The semiconductor device incorporates ceramic circuit boards with specific circuit patterns featuring separate communicating portions and wiring regions, allowing for even current flow and reduced temperature variations by ensuring point symmetry in current conducting paths, thereby preventing overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the rated current is increased for capacity enlargement, then the current handling capability is improved, but abnormal overheating occurs in wiring members
Solution Approach 1:
The patent segments the current conducting path into multiple separate communicating portions (first communicating portion and second communicating portion) that are spatially separated when viewed from the wiring direction. This segmentation distributes the current flow across different regions, preventing concentration of current and subsequent overheating in any single wiring member or location.
Solution Approach 2:
The patent employs asymmetric positioning of the first and second communicating portions relative to the wiring member connections. The communicating portions are deliberately placed at different locations and orientations, creating an asymmetric current distribution pattern that balances heat generation across the circuit board and prevents localized overheating while maintaining high current handling capability.
2Power
If the rated current is increased for capacity enlargement, then the current handling capability is improved, but reliability decreases due to abnormal overheating
Solution Approach 1:
By dividing the current conducting path into multiple separate communicating portions positioned at different locations, the patent prevents current concentration that would cause overheating and reliability failure. The segmented structure ensures that even at high rated currents, the thermal load is distributed across multiple regions rather than concentrated in a single wiring member.
3Power
If communicating portions are positioned to optimize current flow, then current distribution is improved, but thermal management becomes challenging
Solution Approach 1:
The asymmetric positioning of communicating portions creates a current distribution pattern that inherently balances thermal generation across the circuit board. By placing the first and second communicating portions at different locations with different orientations, the patent ensures that heat is generated and dissipated across multiple regions, making thermal management more effective even at high current levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces overheating in wiring members, enhancing the reliability of semiconductor devices by ensuring even current distribution and minimizing temperature increases, keeping the temperature of connecting wires below critical levels.
Implementation Method 1
abnormal overheating may occur in a wiring member, which is not seen in the case of using the appropriate rated current. For example, abnormal overheating occurs in a wire connecting circuit patterns of ceramic circuit boards.
Data Source
AI summary
A semiconductor device, including a first conductive portion including a first conducting region and a first wiring region communicating with the first conducting region via a first communicating portion, a second conductive portion including a second conducting region and a second wiring region that communicates with the second conducting region via a second communicating portion and that faces the first wiring region with a prescribed space therebetween, and a wiring member electrically connecting the first wiring region and the second wiring region in a wiring direction. The first communicating portion and the second communicating portion are separate from each other when viewed from the wiring direction.