Semiconductor Assembly Self-Alignment for Precise Multi-Level Packaging
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges such as warpage, chip shift, surface non-coplanarity, and high production costs due to the lack of efficient and economical methods for high-precision chip placement and alignment, particularly in fan-out and 3D packaging processes.
Innovation Solution
A novel packaging method utilizing self-alignment capability of solder joints between devices and a carrier board, allowing precise alignment and fixation through molten or partially molten solder joints, reducing the need for adhesive films and improving process efficiency and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If high precision mounting equipment is used for chip placement, then manufacturing precision is improved, but device complexity and production cost increase
Solution Approach 1:
The solder joints automatically align the chip to the substrate through self-alignment capability during the molten state, eliminating the need for complex high-precision mounting equipment. The system uses its own solder material properties to achieve the alignment function that would otherwise require external complex equipment.
Solution Approach 2:
The patent replaces mechanical precision mounting systems with a thermal-field-based self-alignment mechanism. Instead of relying on mechanical positioning equipment, the invention uses the fluid dynamics and surface tension properties of molten solder to achieve automatic alignment, substituting a complex mechanical system with a simpler thermal process.
2Manufacturing precision
If high precision mounting equipment is used for chip placement, then manufacturing precision is improved, but productivity decreases
Solution Approach 1:
The solder joints automatically align the chip to the substrate through self-alignment capability during the molten state, eliminating the need for complex high-precision mounting equipment. The system uses its own solder material properties to achieve the alignment function that would otherwise require external complex equipment.
Solution Approach 2:
The patent replaces mechanical precision mounting systems with a thermal-field-based self-alignment mechanism. Instead of relying on mechanical positioning equipment, the invention uses the fluid dynamics and surface tension properties of molten solder to achieve automatic alignment, substituting a complex mechanical system with a simpler thermal process.
3Ease of manufacture
If adhesive films are used for chip fixation, then ease of manufacture is improved, but manufacturing precision deteriorates
Solution Approach 1:
The solder joints automatically align the chip to the substrate through self-alignment capability during the molten state, eliminating the need for complex high-precision mounting equipment. The system uses its own solder material properties to achieve the alignment function that would otherwise require external complex equipment.
Solution Approach 2:
The invention changes the physical state parameter of the solder material from solid to liquid during the bonding process. By controlling the temperature to melt the solder, the system enables automatic alignment through fluid dynamics and surface tension, then solidifies to provide strong fixation, achieving both precision and ease of manufacture.
4Device complexity
If conventional packaging methods are used, then device complexity is maintained, but manufacturing precision deteriorates
Solution Approach 1:
The invention changes the physical state parameter of the solder material from solid to liquid during the bonding process. By controlling the temperature to melt the solder, the system enables automatic alignment through fluid dynamics and surface tension, then solidifies to provide strong fixation, achieving both precision and ease of manufacture.
Solution Approach 2:
The patent employs a composite bonding approach combining solder material with specific physical properties (molten state fluidity, surface tension) to achieve both alignment and fixation functions. This composite material strategy enables simultaneous achievement of precision alignment and strong mechanical bonding without requiring separate complex processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances precision and speed of chip placement, reduces warpage and misalignment issues, and lowers production costs by enabling accurate and efficient alignment of semiconductor devices without the need for high-cost equipment, facilitating smaller and more integrated semiconductor assemblies.
Implementation Method 1
self-alignment capability of solder joints between devices and a carrier board, allowing precise alignment and fixation through molten or partially molten solder joints
Data Source
AI summary
A semiconductor packaging method, a semiconductor assembly and an electronic device are disclosed herein. The semiconductor packaging method comprises forming a first-level assembly, including: align and fix at least one first-level device to a target position on a carrier plate by utilizing the self-alignment capability of first-level alignment solder joints; encapsulating the at least one first-level device to form a molded package body; and exposing the first-level interconnect terminals from the molded package body. The packaging method further comprises align and fix a second-level device to a target position on the first-level assembly by utilizing the self-alignment capability of second-stage alignment solder joints between the first-level assembly and the second-level device. The packaging method improves the operation speed and accuracy of the picking and placing of the first-level device and the second-level device, resulting in improved process efficiency and reduced process cost.