SEM Image Distortion for Semiconductor Conductivity Measurement
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Solution Overview
Problem
Existing methods for measuring electrical conductivity in semiconductor substrates require a separate region for measurement, which differs from the actual device operation and necessitate additional steps, leading to inaccuracies.
Innovation Solution
An electrical conductivity measurement device and method using a scanning electron microscope (SEM) to calculate image shape distortion caused by electrical potential differences, allowing conductivity measurement directly in the operating region of the semiconductor substrate without additional steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a contact probe is used to measure electrical conductivity in a separate pattern region, then the measurement can be performed, but the measurement region differs from the actual device operation region and requires additional measurement patterns
Solution Approach 1:
The invention merges the device inspection function and electrical conductivity measurement function into a single integrated process. The SEM inspection system that normally examines device structures is combined with conductivity measurement capabilities, allowing both structural inspection and electrical property measurement to be performed on the same device region without requiring separate measurement patterns or additional device areas.
Solution Approach 2:
The inspection system is enhanced with multi-functionality by integrating conductivity measurement capabilities into the existing SEM inspection apparatus. The same electron beam and detection systems used for structural inspection are also utilized for measuring electrical conductivity, allowing a single system to perform multiple functions (structural examination and electrical characterization) on the device under test.
2Measurement precision
If a separate measurement region is used for conductivity measurement, then the measurement can be performed, but it requires additional steps and time
Solution Approach 1:
The inspection process and conductivity measurement process are merged into a single operational sequence. The system performs both structural inspection and electrical conductivity measurement on the same device region during the same operational cycle, eliminating the need for separate measurement steps and reducing total process time.
Solution Approach 2:
The system performs preliminary characterization of the device region during the inspection phase, gathering both structural and electrical property data in advance. This preliminary action during inspection eliminates the need for subsequent separate measurement steps, as the conductivity information is already obtained during the initial examination.
3Measurement precision
If conventional measurement methods are used, then electrical conductivity can be measured, but with lower resolution compared to SEM image measurement size
Solution Approach 1:
The high-resolution SEM imaging system, originally designed for structural inspection at sub-micrometer scales, is utilized for conductivity measurement. This leverages the existing high spatial resolution capability of the inspection system to achieve precise localized conductivity measurements that match the resolution level of structural examinations.
Solution Approach 2:
The measurement approach changes from conventional contact-based electrical measurement to a field-based measurement using electron beam interaction. By changing the measurement parameter from physical contact to electron beam induced electrical potential detection, the system achieves measurement resolution consistent with the electron beam's spatial resolution capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise electrical conductivity measurement with a resolution of less than 1 micrometer, eliminating the need for separate measurement regions and providing accurate conductivity data directly from SEM inspection.
Implementation Method 1
a scanning electron microscope configured to obtain a scanning electron microscope (SEM) image of a surface of a semiconductor substrate by scanning the surface of the semiconductor substrate with a focused electron beam
Implementation Method 2
calculating an image shape distortion caused by an electrical potential difference during scanning electron microscope (SEM) measurement
Data Source
AI summary
An electrical conductivity measuring method of a semiconductor substrate according to an embodiment includes: producing a scanning electron microscope (SEM) image of a standard sample using a scanning electron microscope; producing a SEM image of a surface of the semiconductor substrate with the scanning electron microscope; calculating a degree of image distortion by comparing the SEM image of the standard sample and the SEM image of the semiconductor substrate surface; and evaluating the electrical conductivity of the semiconductor substrate based on the degree of image distortion.