Semiconductor Sensor Chip With Through-Silicon Vias
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Solution Overview
Problem
Traditional semiconductor pressure sensor chips face challenges in accurately sensing pressure due to their small size, which limits sensitivity and increases the difficulty of wire connectivity, leading to higher costs and less reliable measurements, especially in applications like catheters where space is constrained.
Innovation Solution
The design incorporates bond pads on both sides of the chip with through-silicon vias (TSVs) for improved wire connectivity, allowing for multiple wires and a full Wheatstone bridge configuration, enhancing sensitivity and eliminating the need for a substrate, thus reducing size and increasing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the pressure sensor chip size is reduced to fit within catheter passageways, then the chip can be used in catheter applications, but the pressure sensing element size decreases leading to lower sensitivity and less accurate pressure measurements
Solution Approach 1:
The patent transitions from planar bond pads to three-dimensional through-silicon vias (TSVs) that penetrate the chip thickness. This vertical dimension allows wire connections to access sensing elements from both top and bottom surfaces, enabling full Wheatstone bridge configuration in a compact footprint while maintaining sensitivity through proper placement of piezoresistive elements on the diaphragm.
2Volume of moving object
If the pressure sensor chip size is reduced, then the chip can fit in catheter applications, but wire connectivity becomes more difficult leading to higher assembly costs and potential yield loss
Solution Approach 1:
The patent introduces through-silicon vias (TSVs) that extend vertically through the chip thickness, creating access points on both the top and bottom surfaces. This three-dimensional approach allows wire bonds to connect to sensing elements from multiple directions, simplifying the wiring process for full bridge configurations and reducing assembly complexity despite the reduced chip footprint.
3Volume of moving object
If bond pads are made smaller to reduce chip size, then the chip can be more compact, but the reliability of wire bonds decreases
Solution Approach 1:
The patent replaces traditional planar bond pads with three-dimensional through-silicon via structures that penetrate the chip thickness. These TSVs provide robust vertical connection paths that can accommodate wire bonds more reliably than small surface pads, maintaining connection strength and reliability while enabling a compact chip design suitable for catheter applications.
4Reliability
If a substrate/die holder is used to simplify manufacturing and ensure wire connection strength, then wire reliability improves, but the overall size of the sub-assembly increases making it difficult to use in catheter applications
Solution Approach 1:
The patent extracts and eliminates the substrate/die holder from the traditional sensor assembly by integrating all necessary functions directly into the semiconductor chip itself. The through-silicon via technology provides inherent mechanical support and wire connection strength without requiring an external substrate, reducing the overall assembly size to fit within catheter passageways while maintaining manufacturing simplicity and connection reliability.
5Quantity of substance
If wire bonding is used to connect wires to the chip, then electrical connections are established, but loops of wire extend above the bond pads requiring additional space inside the catheter passageway
Solution Approach 1:
The patent utilizes the vertical dimension through through-silicon vias to route wire connections through the chip thickness rather than allowing wires to loop above the surface. This three-dimensional connection approach minimizes the horizontal space required within the catheter passageway by confining wire paths to vertical TSV channels and short horizontal segments, significantly reducing the overall volume occupied by wiring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables more accurate and reliable pressure measurements while minimizing the size of the sensor chip, allowing it to be used in tight spaces and reducing the diameter of catheters, thereby improving sensitivity and cost-effectiveness.
Implementation Method 1
a through-silicon via extending between the bottom and top sides and electrically connected to the first and second pads
Implementation Method 2
sensor component located on the top side... The first pad is electrically connected to the sensor component
Data Source
AI summary
Semiconductor sensor chips are provided. In some embodiments, a semiconductor sensor chip can include at least one wire bond pad on one side thereof, at least one bond pad on another, opposite side thereof, and at least one through-silicon via (TSV) extending therebetween and electrically connected to the bond pads on opposite sides of the chip. Each of the bond pads can have a wire attached thereto. In some embodiments, a semiconductor sensor chip can include a pressure sensor, a substrate, and a resistor in a well that provides p-n junction isolation from a body of the substrate. In some embodiments, a semiconductor sensor chip can include a plurality of wire bonds pads with a wire soldered to each of the bond pads. Each of the wires can be soldered with a longitudinal length thereof soldered to its associated bond pad.