Semiconductor Sensor Package Glue-Free Locking Mechanism
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Solution Overview
Problem
Semiconductor packages are prone to glue overflow when using traditional adhesive methods, which can cover essential components and increase fragility, leading to manufacturing difficulties and reduced viability of packages.
Innovation Solution
The use of non-conductive coupling elements, such as plastics or polymers, injected or compressed into substrates with through holes and trenches, forming a locking mechanism that allows for ultrasonic welding of a cap without the need for glue, thereby preventing overflow and enhancing handling stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glue is used to attach the cap to the substrate, then the cap is secured to the substrate, but glue overflow occurs covering essential components and increasing fragility
Solution Approach 1:
The harmful element (glue) is completely removed from the attachment process. The patent replaces adhesive bonding with a mechanical locking mechanism where coupling features (protrusions and recesses) physically interlock the cap and substrate without requiring any adhesive material, thereby eliminating glue overflow entirely
Solution Approach 2:
Coupling features act as intermediary mechanical elements between the cap and substrate. These features (protrusions on one component and corresponding recesses on the other) serve as a mediator to achieve secure attachment through physical interlocking rather than chemical adhesion, providing both connection and misalignment compensation
2Strength
If glue is applied to the substrate to attach the cap, then the cap is secured to the substrate, but the package becomes more fragile and difficult to handle
Solution Approach 1:
The problematic glue material is extracted and replaced with a mechanical coupling system. The coupling features provide inherent structural rigidity and alignment through their geometric design, eliminating the fragility associated with adhesive bonds and improving handling characteristics during manufacturing and assembly
Solution Approach 2:
The coupling features are pre-formed on the cap and substrate components before assembly. This preliminary formation of interlocking geometries ensures proper alignment and secure attachment without requiring delicate adhesive application processes, thereby improving ease of operation and reducing handling difficulties
3Ease of manufacture
If traditional adhesive methods are used, then the cap can be attached to the substrate, but manufacturing yield is reduced due to glue-related defects
Solution Approach 1:
The adhesive material and its associated application processes are completely removed from the manufacturing workflow. The mechanical coupling features enable direct assembly through physical interlocking, eliminating glue-related defects such as overflow, improper curing, and contamination, thereby significantly improving manufacturing yield and productivity
Solution Approach 2:
The coupling features are self-aligning and self-securing through their geometric design. The protrusions and recesses automatically find their correct relative positions and lock together without requiring external adhesive materials or complex alignment procedures, simplifying the manufacturing process and reducing defects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method eliminates glue-related defects, improves handling and structural integrity, and allows for efficient packaging of semiconductor dies or sensors by forming a secure, glue-free bond between the cap and substrate.
Implementation Method 1
compression molding
Implementation Method 2
injection molding
Implementation Method 3
ultrasonic-plastic welding
Data Source
AI summary
A package packaged with a cap. The package features trenches, through holes, and a non-conductive coupling element forming a locking mechanism integrated embedded or integrated within a substrate. The package has a cap coupled to the non-conductive coupling element through ultrasonic plastic welding. The package protects the dice from an outside environment or external stresses or both. A method is desired to form package to reduce glue overflow defects in the package. Fabrication of the package comprises drilling holes in a substrate; forming trenches in the substrate; forming a non-conductive coupling element in the through holes and the trenches to form a locking mechanism; allowing the non-conductive coupling element to harden and cure; coupling a die or dice to the substrate; and coupling a cap to the non-conductive coupling element to protect the die or dice from an outside environment or external stresses or both.