Semiconductor Module Sensor Layout for Direct Heat Source Measurement
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Solution Overview
Problem
Current temperature sensing solutions in power modules are inefficient due to increased area requirements, cost, complexity, and inaccuracy, which can lead to acute device failure and reduced useful life.
Innovation Solution
A semiconductor module with a stacked arrangement of circuit carriers, where temperature sensors are fixedly attached to the upper circuit carrier and positioned vertically between the circuit carriers to obtain direct temperature measurements of heat generating elements, eliminating the need for additional temperature sensing elements and reducing module size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If current temperature sensing solutions are used in power modules, then temperature monitoring is achieved, but area requirements increase, cost increases, complexity increases, and measurement accuracy decreases
Solution Approach 1:
The temperature sensor is positioned in the vertical dimension between the first and second circuit carriers, rather than placing it on the same plane as heat-generating elements. This vertical positioning allows direct temperature measurement while avoiding lateral space constraints that contribute to increased area requirements and device complexity.
Solution Approach 2:
The second circuit carrier serves multiple functions: it provides mechanical support for mounting temperature sensors, acts as a reference temperature measurement point, and enables vertical spacing for sensor placement. This multi-functionality reduces the need for separate dedicated temperature sensing structures, thereby reducing overall device complexity.
2Measurement precision
If temperature sensors are placed close to heat generating elements, then direct temperature measurement is achieved, but area requirements increase
Solution Approach 1:
The solution transitions from lateral placement of temperature sensors next to heat-generating elements to vertical placement between circuit carriers. This dimensional change allows the sensor to be in sufficient proximity for direct temperature measurement without consuming additional lateral module area.
Solution Approach 2:
The temperature sensor is nested within the vertical space already defined by the stacked circuit carrier configuration. Rather than adding external sensing elements that increase module footprint, the sensor utilizes the existing vertical inter-carrier space, effectively nesting the sensing function within the module's structural envelope.
3Measurement precision
If multiple temperature sensing elements are added to improve accuracy, then measurement precision improves, but device complexity and cost increase
Solution Approach 1:
The second circuit carrier is designed to serve as a universal mounting platform for temperature sensors that can monitor multiple heat-generating elements. A single sensor positioned on the second carrier can measure temperatures of multiple elements below it, eliminating the need for separate sensing elements for each heat source and thereby simplifying manufacturing.
Solution Approach 2:
The stacked circuit carrier structure itself provides the positioning and support infrastructure for temperature sensors. The vertical spacing and mechanical structure of the carriers automatically facilitate sensor placement and orientation toward heat-generating elements, reducing the need for additional complex mounting mechanisms and simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides accurate and efficient temperature monitoring, reducing the risk of device failure and extending the useful life of power modules by directly measuring heat generating elements, thus enhancing thermal management.
Implementation Method 1
the temperature sensor is arranged in sufficient proximity to a first one of the heat generating elements to obtain a direct temperature measurement from the first one of the heat generating elements
Data Source
AI summary
A semiconductor module includes a first circuit carrier including one or more heat generating elements mounted on an upper surface of the first circuit carrier, a second circuit carrier mounted over the first circuit carrier and being vertically spaced apart from the upper surface of the first circuit carrier, and a temperature sensor that is fixedly attached to the second circuit carrier and is arranged in a vertical space between the lower surface of the second circuit carrier and the upper surface of the first circuit carrier, wherein the temperature sensor is arranged in sufficient proximity to a first one of the heat generating elements to obtain a direct temperature measurement from the first one of the heat generating elements.