Semiconductor Module Shield Layout for Busbar Noise Isolation
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Solution Overview
Problem
Semiconductor apparatuses face increased size and manufacturing costs due to excessive shielding, while radiation noise from busbars can cause control unit malfunctions, necessitating an efficient shielding solution.
Innovation Solution
A semiconductor apparatus with a shield section strategically arranged between the control unit and busbars to minimize size and cost, specifically targeting the side surface most affected by radiation noise, thereby reducing or blocking noise emissions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entire substrate is covered with a shield section to prevent radiation noise from affecting the control unit, then the control unit is protected from malfunction, but the apparatus size and manufacturing cost increase
Solution Approach 1:
The shield section is positioned only at the specific location between the busbar and control unit where radiation noise impact is most significant, rather than covering the entire substrate. This localized shielding approach maintains protection effectiveness while reducing the overall shield area, thereby preventing apparatus size increase.
Solution Approach 2:
The shielding function is segmented and applied only to the critical region between the busbar and control unit, rather than implementing uniform full-substrate shielding. This segmentation allows the shield section to be strategically placed only where needed, reducing total shield material and apparatus size.
2Reliability
If the entire substrate is covered with a shield section to prevent radiation noise from affecting the control unit, then the control unit is protected from malfunction, but manufacturing cost increases
Solution Approach 1:
The shield section is positioned only at the specific location between the busbar and control unit where radiation noise impact is most significant, rather than covering the entire substrate. This localized shielding approach maintains protection effectiveness while reducing the overall shield area, thereby preventing manufacturing cost increase.
Solution Approach 2:
The shielding function is segmented and applied only to the critical region between the busbar and control unit, rather than implementing uniform full-substrate shielding. This segmentation allows the shield section to be strategically placed only where needed, reducing total shield material and manufacturing cost.
3Volume of moving object
If the distance between the control unit and busbar is reduced to improve integration, then device compactness is improved, but radiation noise interference increases
Solution Approach 1:
A shield section is introduced as an intermediary element between the busbar and control unit. This shield acts as a mediator that blocks radiation noise while allowing the busbar and control unit to remain in close proximity for compact integration, thus resolving the conflict between compactness and noise interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents control unit malfunctions from radiation noise while maintaining a compact design and reducing manufacturing costs by optimizing the shield section's placement and size.
Implementation Method 1
a shield section arranged between at least respective opposing surfaces of the control unit and the busbar
Data Source
AI summary
A semiconductor apparatus includes a semiconductor module, a substrate having a control unit that controls an operation of the semiconductor module, a busbar that allows a current to flow through the semiconductor module, and a shield arranged between at least respective opposing surfaces of the control unit and the busbar that oppose to each other.