Semiconductor Package Shield Layer via Inclined Side Surface
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Solution Overview
Problem
Existing semiconductor package manufacturing methods face challenges in forming a uniform and efficient electromagnetic shield layer on both the upper and side surfaces of semiconductor packages, particularly due to the perpendicular side surfaces and time-consuming deposition methods.
Innovation Solution
A semiconductor package manufacturing method that involves bonding semiconductor chips to a wiring substrate, forming a resin layer, creating V grooves on the substrate to incline the side surfaces, and then depositing a conductive material perpendicular to these surfaces to form a shield layer, allowing for efficient formation of a shield layer with a predetermined thickness on both surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sheet metal shield is used to form the shield layer, then the shield function is sufficient, but the thickness becomes large which hinders reduction in size and thickness of equipment
Solution Approach 1:
The patent changes the thickness parameter of the shield layer from millimeter-scale (sheet metal) to micrometer-scale (deposited film), achieving the same electromagnetic shielding function with dramatically reduced thickness through film deposition methods
2Length of moving object
If film deposition method is used to form a thin shield layer, then the thickness is reduced, but much time is required to form the shield layer on the side surface due to perpendicular deposition direction
Solution Approach 1:
The patent changes the side surface from perpendicular to inclined, creating an asymmetric geometry that allows the deposition direction (perpendicular to upper surface) to effectively cover the side surface, reducing deposition time while maintaining uniform thickness
3Device complexity
If the side surface is perpendicular to the upper surface, then the package structure is simple, but it is difficult to form a shield layer having uniform thickness on both the upper surface and the side surface
Solution Approach 1:
The patent introduces an inclined side surface geometry that transforms the deposition challenge: the inclination angle allows the perpendicular deposition beam to naturally cover the side surface at an effective angle, achieving uniform thickness distribution across both upper and side surfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the efficient formation of a shield layer with a sufficient thickness on both the upper and side surfaces of semiconductor packages, effectively suppressing electromagnetic noise leakage while reducing the complexity and time required for shield layer deposition.
Implementation Method 1
cutting the sealed substrate along each division line by using a processing tool to a depth from the upper surface of the resin layer to the half of the thickness of the wiring substrate, thereby forming a V groove
Implementation Method 2
holding the wiring substrate of the sealed substrate on a holding jig
Data Source
AI summary
A plurality of semiconductor packages are manufactured by a method that includes the steps of bonding a plurality of semiconductor chips on the front side of a wiring substrate, next supplying a sealing compound to the front side of the wiring substrate to form a resin layer from the sealing component on the front side of the wiring substrate, thereby forming a sealed substrate including the wiring substrate and the resin layer covering the semiconductor chips, next cutting the sealed substrate from the resin layer side by using a V blade to thereby form a V groove along each division line, next dividing the wiring substrate along each V groove to obtain a plurality of individual bare packages, and finally forming an electromagnetic shield layer on the upper surface and an inclined side surface of each bare package, thereby obtaining the plural semiconductor packages.