Semiconductor Package Shield Layer for EMI and X-Ray Protection
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Solution Overview
Problem
Semiconductor packages face issues with electromagnetic interference and X-ray damage during inspection, which affect the reliability and functionality of electronic devices.
Innovation Solution
A semiconductor package design incorporating a shield layer with conductive structures and nano-structures, including semiconductor materials, that is integrated onto a molding layer to shield electromagnetic waves and X-rays, thereby reducing interference and preventing damage to the semiconductor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional semiconductor package without shield layer is used, then the device complexity is low and manufacturing is simple, but electromagnetic interference occurs between the semiconductor package and other electronic devices
Solution Approach 1:
The shield layer is constructed as a composite material comprising a polymer matrix with dispersed conductive structures (such as metal particles or conductive fillers) and nano-structures. This composite structure provides electromagnetic shielding functionality while maintaining processability and integration with existing semiconductor packaging processes.
Solution Approach 2:
The shield layer is positioned specifically on the molding layer that covers the semiconductor chip, providing electromagnetic shielding only where needed - i.e., where the chip and its interconnections are most vulnerable to interference. This localized approach protects critical components without unnecessarily complicating the entire package structure.
2Reliability
If no shield layer is used, then the manufacturing process is simple, but X-ray damage occurs during inspection
Solution Approach 1:
The shield layer incorporates high-Z elements (such as bismuth, tungsten, or lead oxide particles) within the polymer matrix. These high-Z materials effectively attenuate X-rays during inspection processes, preventing damage to the semiconductor chip while the polymer binder maintains structural integrity and facilitates manufacturing.
Solution Approach 2:
The shield layer is applied to the molding layer before final packaging and inspection processes. This preliminary protective measure ensures that when X-ray inspection is subsequently performed, the chip is already protected from potential damage, eliminating the need for special handling or post-inspection repairs.
3Object-affected harmful factors
If a shield layer with conductive structures is added, then electromagnetic interference is reduced, but the device complexity increases
Solution Approach 1:
The shield layer utilizes a polymer matrix with dispersed conductive structures that create an effective electromagnetic shielding network. The conductive particles or structures are distributed throughout the polymer, forming a porous yet conductive matrix that intercepts and redirects electromagnetic waves, reducing interference without requiring solid continuous metal layers.
Solution Approach 2:
The polymer matrix serves as an intermediary material that binds the conductive structures together, providing both mechanical support and electromagnetic shielding functionality. This intermediary approach allows the conductive elements to work together as a unified shielding layer while maintaining flexibility and ease of integration into the packaging process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shield layer effectively reduces electromagnetic interference and X-ray exposure, enhancing the reliability and operational stability of semiconductor packages by minimizing disturbances from external electromagnetic waves and protecting the semiconductor chip during inspection.
Implementation Method 1
a shield layer on the molding layer. The shield layer may include a polymer in which a plurality of conductive structures and a plurality of nano-structures are distributed
Implementation Method 2
The first nano-structures may include a semiconductor material
Data Source
AI summary
Disclosed is a semiconductor package comprising a substrate, a semiconductor chip on the substrate, a molding layer on the substrate covering the semiconductor chip, and a shield layer on the molding layer. The shield layer includes a polymer in which a plurality of conductive structures and a plurality of nano-structures are distributed wherein at least some of the conductive structures are connected to one another.