Semiconductor Package Shield Layer Laser Marking
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Solution Overview
Problem
Conventional methods for suppressing electromagnetic noise in portable radio communication devices, such as using a metal sheet enclosure, result in increased device size and height, and may compromise shield performance or visibility when product information is marked by laser due to penetration through the shield layer.
Innovation Solution
A semiconductor device with a shield layer formed on the molding resin after laser marking, using a thin metal layer to minimize size and thickness while maintaining visibility and enhancing shield performance by grounding the semiconductor device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal sheet enclosure is used to suppress electromagnetic noise, then shield performance is improved, but device size and height increase
Solution Approach 1:
The patent applies a thin film shield layer (5-20 μm thickness) directly on the molding resin surface instead of using a bulky metal sheet enclosure. This thin film approach provides effective electromagnetic shielding while minimizing impact on device size and height, directly resolving the contradiction between shield performance and device compactness.
Solution Approach 2:
The shield layer is integrated into the package structure by forming it on the molding resin that already encapsulates the semiconductor element. This nesting approach embeds the shielding function within the existing package architecture, providing effective shielding without adding external enclosure volume.
2Volume of moving object
If a shield layer is formed by plating to reduce device size, then device thickness decreases, but shield performance may be impaired due to laser penetration
Solution Approach 1:
The patent performs laser marking on the molding resin surface before forming the shield layer. This preliminary action ensures that the marking is completed before the shield layer is deposited, preventing any potential laser penetration through a thin shield layer and maintaining both visibility and shield performance.
Solution Approach 2:
The patent optimizes the shield layer thickness to a specific range (5-20 μm) that balances electromagnetic shielding effectiveness with visibility of the underlying marking. This parameter optimization ensures sufficient shielding performance while maintaining the visibility of product information marked on the molding resin.
3Illumination intensity
If laser marking depth is increased to improve visibility, then visibility is improved, but shield performance deteriorates due to penetration
Solution Approach 1:
The patent performs laser marking before forming the shield layer, so the marking is created on the molding resin surface without needing to penetrate through a metal shield layer. This preliminary action achieves high visibility while maintaining shield integrity, as the shield layer is deposited afterward and does not interfere with the marking visibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces device size and height while ensuring reliable shielding and maintaining visibility of product information, with improved mechanical strength and shield performance by forming a thin shield layer on the molding resin after laser marking.
Implementation Method 1
a shield layer provided on the molding resin... to suppress such a noise
Implementation Method 2
product information is marked by a laser... marking portion by laser irradiation on a surface
Implementation Method 3
a shield layer can be formed to be very thin, which leads to further decrease in size and thickness of the device
Data Source
AI summary
According to one embodiment, there is disclosed a semiconductor device which has a wiring substrate, a semiconductor element mounted on the wiring substrate, a molding resin which seals the semiconductor element, and a shield layer provided on the molding resin, wherein the molding resin has a marking portion by laser irradiation on a surface, and the shield layer is provided on the molding resin having the marking portion.