Semiconductor Shield Structure for Uniform Pre-Dicing EMI Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face issues with electromagnetic shield layer thickness variance and interference due to post-dicing shield film formation, leading to inconsistent electromagnetic shielding performance.
Innovation Solution
A semiconductor device design with pre-dicing formation of in-groove and in-hole metals on a multi-layer board, integrated with a metal film and grounding patterns, to provide consistent electromagnetic shielding before dicing into individual units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If electromagnetic shield layer is formed after package dicing, then each diced package can be individually processed, but thickness variance occurs in the electromagnetic shield layer among package products
Solution Approach 1:
The electromagnetic shield layer is formed on the insulating sealing member before the dicing process. By performing the shield formation action in advance while the substrate is still in wafer form, the shielding structure is created uniformly across all packages simultaneously, eliminating thickness variance that would occur with post-dicing formation.
Solution Approach 2:
The formation of electromagnetic shields for multiple individual packages is merged into a single simultaneous process step. Instead of processing each package separately after dicing, the shield layer is formed once across the entire insulating sealing member that contains multiple packages, achieving both efficiency and uniformity.
2Productivity
If shield film formation process is performed after dicing, then each package can be processed independently, but production time and process complexity increase
Solution Approach 1:
The electromagnetic shield formation is performed as a preliminary step before dicing, eliminating the need for a separate post-dicing shield formation process. This reduces the total number of process steps and simplifies the manufacturing workflow.
Solution Approach 2:
The shield formation process for all packages is merged into a single batch operation performed on the insulating sealing member before dicing. This consolidation reduces production time by eliminating repeated processing cycles for each individual package.
Data Source
AI summary
A semiconductor device includes a multi-layer board which a wiring pattern and a grounding pattern are formed. A plurality of semiconductor elements are mounted on the multi-layer board. An insulating sealing member is provided on the multi-layer board and is covering the plurality of semiconductor elements. A metal film is provided on the insulating sealing member. An in-groove metal is provided in contact with a plurality of grooves extending from a side-surface upper end of the insulating sealing member to a side-surface lower end of the multi-layer board. An in-hole metal is provided in an inner wall of a hole penetrating through the insulating sealing member and is extending to the multi-layer board. The in-hole metal is contacting with the metal film and the grounding pattern.