Semiconductor Shield Structure With Rewiring Layer EMI Containment
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Solution Overview
Problem
Existing electronic circuit devices with electromagnetic wave shield structures, such as FOWLP and MCP, face challenges in achieving a reliable and cost-effective electromagnetic wave shield function due to increased manufacturing processes and quality maintenance issues with metal film formation on three-dimensional packages.
Innovation Solution
The implementation of a plane-shaped shield member with a conductive metal film, an insulating photosensitive resin layer, and a rewiring layer including copper wiring photo vias and a shield groove to enclose and shield the semiconductor chip, providing a reliable electromagnetic wave shield while reducing manufacturing complexity and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal film is formed on a three-dimensional package by sputtering process to create an electromagnetic wave shield structure, then the electromagnetic wave shield function is achieved, but the manufacturing complexity and cost increase
Solution Approach 1:
The shield structure is divided into multiple conductive layers (first conductive layer, second conductive layer, third conductive layer) formed at different stages of the packaging process. Each layer serves a specific shielding function and can be formed using different manufacturing techniques, reducing overall process complexity while maintaining effective electromagnetic wave shielding.
Solution Approach 2:
The first conductive layer is formed on the semiconductor chip surface before the chip is mounted on the packaging substrate. This preliminary formation of the conductive layer simplifies subsequent packaging steps and reduces the complexity of forming the complete shield structure, as the base layer is already in place before final assembly.
2Reliability
If a metal case is used to enclose the semiconductor chip to provide electromagnetic wave shielding, then the shield function is achieved, but the manufacturing cost and process complexity increase
Solution Approach 1:
The invention extracts the essential shielding function from the complete metal case concept and implements it through selective conductive layers only where electromagnetic shielding is needed. The first, second, and third conductive layers are strategically placed to provide shielding without requiring a full metal enclosure, significantly reducing manufacturing cost and process complexity while maintaining effective shielding performance.
Solution Approach 2:
Instead of applying a uniform metal case or metal film throughout, the conductive layers are applied locally at specific positions: on the chip surface, on the packaging substrate, and at the periphery. This localized approach provides shielding exactly where needed while minimizing material usage and manufacturing complexity.
3Productivity
If multiple conductive layers are formed simultaneously to create an electromagnetic wave shield structure, then the shield function is achieved with reduced manufacturing steps, but the manufacturing precision requirements increase
Solution Approach 1:
The first conductive layer is formed on the semiconductor chip surface before mounting, allowing precise formation on a stable, accessible surface. This preliminary action ensures high precision for the base layer before the chip is integrated into the final package structure, making subsequent alignment of additional layers easier and more precise.
Solution Approach 2:
Each conductive layer is formed with specific local properties and patterns matched to its functional requirements. The first layer covers the chip surface, the second layer is on the packaging substrate, and the third layer provides peripheral shielding. This localized, function-specific formation approach allows each layer to be optimized independently, reducing overall precision requirements while maintaining effective shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a highly reliable and cost-effective electromagnetic wave shield function for semiconductor devices, preventing electromagnetic noise and mechanical damage, and is suitable for system integration of semiconductor chips.
Implementation Method 1
a plane-shaped shield member 12 with a conductive metal film... and a wall-shaped shield groove 44d made from a third conductor for a sealing arranged to surround a thickness direction of the electronic circuit element... The plane-shaped shield member and the wall-shaped groove are electrically connected to provide an electromagnetic wave shield structure that surrounds the electronic circuit element
Data Source
AI summary
An electronic circuit device includes a plane-shaped shield member having conductivity, at least one electronic circuit element having a first surface opposed to a second surface on which a connecting part is formed, the first surface arranged on the plane-shaped shield member, a rewiring layer comprises an insulating photosensitive resin layer enclosing the electronic circuit element on the plane-shaped shield member, a plurality of wiring photo vias having a plurality of first conductors electrically connected to a connecting part of the electronic element, a wiring having a second conductor electrically connected to each of the plurality of wiring photo vias on the same surface parallel to the plane-shaped shield member, and a wall-shaped shield groove having a third conductor for a sealing arranged to surround a thickness direction of the electronic circuit element.